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公开(公告)号：US10667418B2
公开(公告)日：2020-05-26
申请号：US15958915
申请日：2018-04-20
Applicant: Apple Inc.
Inventor： Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Michael P. Coleman , Thomas Johannessen , Richard W. Heley
IPC: G06F1/16 , H05K5/04 , B23P11/00 , B23P17/00 , G03F1/38 , H01Q1/24 , H04M1/02 , C25D11/34 , H05K5/02 , H05K13/00 , C25D11/02 , C25D7/00 , C25D11/12 , H05K5/03 , H01Q1/42 , B23C5/10 , B23C5/00 , B23P17/02 , H04M1/11 , C25D11/24
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号：US10372166B2
公开(公告)日：2019-08-06
申请号：US15212029
申请日：2016-07-15
Applicant: Apple Inc.
Inventor： Brian M. Gable , Carlo Di Nallo , Colin M. Ely , Craig A. Horton , Erik G. de Jong , Fletcher R. Rothkopf , Henry B. Wettersten , Hoishun Li , Jason C. Sauers , Jayesh Nath , Mario Martinis , Mattia Pascolini , Michael P. Coleman , Rex T. Ehman , Zheyu Wang
IPC: G06F1/16 , H01Q1/22 , H04B1/3888 , H04M1/02 , H05K5/00 , H05K5/04 , B29C70/76 , H01Q1/24 , H01Q21/28 , H04M1/18 , B29L31/34
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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公开(公告)号：US20180066374A1
公开(公告)日：2018-03-08
申请号：US15615815
申请日：2017-06-06
Applicant: Apple Inc.
Inventor： Duy P. Le , Masashige Tatebe , Jody R. Akana , Jeremy D. Bataillou , Shota Aoyagi , Richard Hung Minh Dinh , Ricky C. Lee , Thomas Johannessen , Benjamin S. Bustle , Rasamy Phouthavong , Zechariah D. Feinberg , Tiffany Hu , Dandan Wan , Chuanyou Su , Phillip W. Hum , Michael P. Coleman , Jong Kong Lee
CPC classification number: C25D11/243 , C22F1/04 , C25D11/16 , C25D11/18 , H04M1/0202 , H04M1/026 , H04M1/0283 , H04M1/185
Abstract: A high gloss deep black housing for a handheld electronic device is disclosed having either a textured or a mirror finish. Methods for preparing a housing having the high gloss deep black finish are also disclosed, including housings for mobile phones.
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公开(公告)号：US20180017995A1
公开(公告)日：2018-01-18
申请号：US15212029
申请日：2016-07-15
Applicant: Apple Inc.
Inventor： Brian M. Gable , Carlo Di Nallo , Colin M. Ely , Craig A. Horton , Erik G. de Jong , Fletcher R. Rothkopf , Henry B. Wettersten , Hoishun Li , Jason C. Sauers , Jayesh Nath , Mario Martinis , Mattia Pascolini , Michael P. Coleman , Rex T. Ehman , Zheyu Wang
CPC classification number: G06F1/1656 , B29L2031/3481 , G06F1/163 , G06F1/1637 , H01Q1/22 , H01Q1/243 , H01Q21/28 , H04B1/3888 , H04M1/0202 , H04M1/0249 , H04M1/18 , H05K5/0013 , H05K5/04
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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