公开(公告)号：US09942986B1

公开(公告)日：2018-04-10

申请号：US15400677

申请日：2017-01-06

申请人： Apple Inc.

发明人： Koohee Han ,  Hui Chen ,  Kuo-Hua Sung ,  Cyrus Y. Liu ,  To C. Tan

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K3/10 ,  H05K3/36 ,  H05K3/38

CPC分类号： H05K1/144 ,  H05K1/028 ,  H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/365 ,  H05K3/38 ,  H05K2201/041 ,  H05K2203/10

摘要： Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.

公开(公告)号：US20180092209A1

公开(公告)日：2018-03-29

申请号：US15400677

申请日：2017-01-06

申请人： Apple Inc.

发明人： Koohee Han ,  Hui Chen ,  Kuo-Hua Sung ,  Cyrus Y. Liu ,  To C. Tan

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K3/10 ,  H05K3/36 ,  H05K3/38

CPC分类号： H05K1/144 ,  H05K1/028 ,  H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/365 ,  H05K3/38 ,  H05K2201/041 ,  H05K2203/10

摘要： Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.