公开(公告)号：US20220286540A1

公开(公告)日：2022-09-08

申请号：US17472140

申请日：2021-09-10

Applicant: Apple Inc.

Inventor： Jason M. Gillier ,  Jiachen Xu ,  Yi Xu ,  Griffin L. Schmitt ,  Nicholas Merz ,  Daniel Jarvis ,  Marwan Rammah

IPC: H04M1/02 ,  H04R1/02

Abstract: A portable electronic device may include a touch-sensitive display, a housing at least partially enclosing the touch-sensitive display, the housing defining an audio port along a side of the housing, the audio port defining a partially enclosed volume, and an acoustic module positioned within the housing and including an audio enclosure defining a first passage and a second passage, a microphone operably coupled to the partially enclosed volume of the audio port by the first passage, a pressure sensor operably coupled to the partially enclosed volume of the audio port by the second passage, and an acoustic mesh positioned between an end of the second passage and the audio port.

公开(公告)号：US12225146B2

公开(公告)日：2025-02-11

申请号：US17472140

申请日：2021-09-10

Applicant: Apple Inc.

Inventor： Jason M. Gillier ,  Jiachen Xu ,  Yi Xu ,  Griffin L. Schmitt ,  Nicholas Merz ,  Daniel Jarvis ,  Marwan Rammah

IPC: H04M1/02 ,  H04R1/02 ,  H04R1/28

Abstract: A portable electronic device may include a touch-sensitive display, a housing at least partially enclosing the touch-sensitive display, the housing defining an audio port along a side of the housing, the audio port defining a partially enclosed volume, and an acoustic module positioned within the housing and including an audio enclosure defining a first passage and a second passage, a microphone operably coupled to the partially enclosed volume of the audio port by the first passage, a pressure sensor operably coupled to the partially enclosed volume of the audio port by the second passage, and an acoustic mesh positioned between an end of the second passage and the audio port.

公开(公告)号：US20230317624A1

公开(公告)日：2023-10-05

申请号：US18058991

申请日：2022-11-28

Applicant: Apple Inc.

Inventor： Wei Chen ,  Yi Xu ,  Jie-Hua Zhao ,  Jun Zhai

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L23/5386 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/18 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48225

Abstract: Microelectronic packages and methods of fabrication are described. In an embodiment, a redistribution layer spans across multiple components, and includes a region of patterned wiring traces that may mitigate stress in the RDL between the multiple components.