公开(公告)号：US20200217423A1

公开(公告)日：2020-07-09

申请号：US16642827

申请日：2018-09-28

Applicant: Applied Materials, Inc.

Inventor： Benjamin B. RIORDON ,  Charles T. CARLSON ,  Aaron WEBB ,  Gary WYKA

IPC: F16K1/20 ,  F16K49/00 ,  F16K51/02 ,  H01J37/32

Abstract: The present disclosure generally relates to an isolation device for use in processing systems. The isolation device has a body with an inlet opening disposed at a first end coupled to a processing system component such as a remote plasma source and outlet openings, for example two, disposed at a second end which are coupled to a processing system component such as a process chamber. Flaps disposed within the body are actuatable to an open position from a closed position or to a closed position from an open position, to selectively allow or prevent passage of a fluid from the processing system component coupled to the isolation device to the other processing system component coupled thereto.

公开(公告)号：US20190293199A1

公开(公告)日：2019-09-26

申请号：US16341703

申请日：2017-12-01

Applicant: Applied Materials, Inc.

Inventor： Charles T. CARLSON ,  Tammy Jo PRIDE ,  Benjamin B. RIORDON ,  Aaron WEBB

IPC: F16K27/02 ,  F16K1/20 ,  F16K11/10

Abstract: Embodiments of the disclosure generally relate to a flapper valve. The flapper valve may be used with processing chambers, such as semiconductor substrate processing chambers. In one embodiment, a flapper valve includes a housing having a first opening at a first end thereof and a second opening at a second end thereof, a first flapper pivotably disposed in the housing, and a second flapper pivotably disposed in the housing. The first and second flappers are movable to selectively open and close at least one of the first opening and the second opening.

公开(公告)号：US20190148186A1

公开(公告)日：2019-05-16

申请号：US16157808

申请日：2018-10-11

Applicant: Applied Materials, Inc.

Inventor： Jason M. SCHALLER ,  Robert Brent VOPAT ,  Charles T. CARLSON ,  Jeffrey Charles BLAHNIK ,  Timothy J. FRANKLIN ,  David BLAHNIK ,  Aaron WEBB

IPC: H01L21/67 ,  H01L21/673

Abstract: Apparatuses for annealing semiconductor substrates, such as a batch processing chamber, are provided herein. The batch processing chamber includes a chamber body enclosing an internal volume, a cassette moveably disposed within the internal volume and a plug coupled to a bottom wall of the cassette. The chamber body has a hole through a bottom wall of the chamber body and is interfaced with one or more heaters operable to maintain the chamber body at a temperature of greater than 290° C. The cassette is configured to be raised to load a plurality of substrates thereon and lowered to seal the internal volume. The plug is configured to move up and down within the internal volume. The plug includes a downward-facing seal configured to engage with a top surface of the bottom wall of the chamber body and close the hole through the bottom wall of the chamber body.