公开(公告)号：US20140141696A1

公开(公告)日：2014-05-22

申请号：US13791733

申请日：2013-03-08

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D Ambra ,  Jagan Rangarajan

IPC: B24B37/013

CPC classification number: B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/345

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。