公开(公告)号：US12165934B2

公开(公告)日：2024-12-10

申请号：US16938510

申请日：2020-07-24

Applicant: Applied Materials, Inc.

Inventor： Zuoming Zhu ,  Shu-Kwan Lau ,  Ala Moradian ,  Enle Choo ,  Flora Fong-Song Chang ,  Vilen K Nestorov ,  Zhiyuan Ye ,  Bindusagar Marath Sankarathodi ,  Maxim D. Shaposhnikov ,  Surendra Singh Srivastava ,  Zhepeng Cong ,  Patricia M. Liu ,  Errol C. Sanchez ,  Jenny C. Lin ,  Schubert S. Chu ,  Balakrishnam R. Jampana

IPC: H01L21/66 ,  H01L21/67

Abstract: A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.