公开(公告)号：US11635338B2

公开(公告)日：2023-04-25

申请号：US17079040

申请日：2020-10-23

Applicant: Applied Materials, Inc.

Inventor： Martin A. Hilkene ,  Surendra Singh Srivastava

IPC: G01M3/02 ,  H01L21/67

Abstract: Methods and apparatus for detecting a vacuum leak within a processing chamber are described herein. More specifically, the methods and apparatus relate to the utilization of a spectral measurement device, such as a spectral gauge, to determine the leak rate within a process chamber while the process chamber is held at a leak test pressure. The spectral measurement device determines the rate of increase of one or more gases within the processing chamber and can be used to determine if the processing chamber passes or fails the leak test.

公开(公告)号：US11860973B2

公开(公告)日：2024-01-02

申请号：US17081459

申请日：2020-10-27

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Martin A. Hilkene ,  Zuoming Zhu ,  Errol Antonio C. Sanchez ,  Bindusagar Marath Sankarathodi ,  Patricia M. Liu ,  Surendra Singh Srivastava

IPC: G06K9/62 ,  G06F18/214 ,  H01L21/02 ,  G06N20/00 ,  G06F18/24

CPC classification number: G06F18/214 ,  G06F18/24 ,  G06N20/00 ,  H01L21/0206 ,  H01L21/02019

Abstract: Systems, apparatus, and methods are disclosed for foreline diagnostics and control. A foreline coupled to a chamber exhaust is instrumented with one or more sensors, in some embodiments placed between the chamber exhaust and an abatement system. The one or more sensors are positioned to measure pressure in the foreline as an indicator of conductance. The sensors are coupled to a trained machine learning model configured to provide a signal when the foreline needs a cleaning cycle or when preventive maintenance should be performed. In some embodiments, the trained machine learning predicts when cleaning or preventive maintenance will be needed.

公开(公告)号：US12165934B2

公开(公告)日：2024-12-10

申请号：US16938510

申请日：2020-07-24

Applicant: Applied Materials, Inc.

Inventor： Zuoming Zhu ,  Shu-Kwan Lau ,  Ala Moradian ,  Enle Choo ,  Flora Fong-Song Chang ,  Vilen K Nestorov ,  Zhiyuan Ye ,  Bindusagar Marath Sankarathodi ,  Maxim D. Shaposhnikov ,  Surendra Singh Srivastava ,  Zhepeng Cong ,  Patricia M. Liu ,  Errol C. Sanchez ,  Jenny C. Lin ,  Schubert S. Chu ,  Balakrishnam R. Jampana

IPC: H01L21/66 ,  H01L21/67

Abstract: A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.

公开(公告)号：US12196617B2

公开(公告)日：2025-01-14

申请号：US17609335

申请日：2020-06-29

Applicant: Applied Materials, Inc.

Inventor： Zuoming Zhu ,  Shu-Kwan Lau ,  Enle Choo ,  Ala Moradian ,  Flora Fong-Song Chang ,  Maxim D. Shaposhnikov ,  Bindusagar Marath Sankarathodi ,  Zhepeng Cong ,  Zhiyuan Ye ,  Vilen K. Nestorov ,  Surendra Singh Srivastava ,  Saurabh Chopra ,  Patricia M. Liu ,  Errol Antonio C. Sanchez ,  Jenny C. Lin ,  Schubert S. Chu

IPC: G01J5/00 ,  H01L21/67

Abstract: An apparatus for controlling temperature profile of a substrate within an epitaxial chamber includes a bottom center pyrometer and a bottom outer pyrometer to respectively measure temperatures at a center location and an outer location of a first surface of a susceptor of an epitaxy chamber, a top center pyrometer and a top outer pyrometer to respectively measure temperatures at a center location and an outer location of a substrate disposed on a second surface of the susceptor opposite the first surface, a first controller to receive signals, from the bottom center pyrometer and the bottom outer pyrometer, and output a feedback signal to a first heating lamp module that heats the first surface based on the measured temperatures of the first surface, and a second controller to receive signals, from the top center pyrometer, the top outer pyrometer, the bottom center pyrometer, and the bottom outer pyrometer, and output a feedback signal to a second heating lamp module that heats the substrate based on the measured temperatures of a substrate and the measured temperatures of the first surface.