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    METHOD OF INSPECTING A SAMPLE, AND MULTI-ELECTRON BEAM INSPECTION SYSTEM
    1.
    发明申请
    METHOD OF INSPECTING A SAMPLE, AND MULTI-ELECTRON BEAM INSPECTION SYSTEM 有权

    公开(公告)号：US20230133404A1

    公开(公告)日：2023-05-04

    申请号：US17906454

    申请日：2020-04-17

    Applicant: Applied Materials, Inc.

    Inventor： Bernhard G. MUELLER ,  Peter NUNAN

    IPC: G01N23/2251

    Abstract: A method for inspecting a sample with a multi-electron beam inspection system (100) is described. The method includes: placing the sample on a movable stage (110) extending in an X-Y-plane; generating a plurality of electron beams (105) propagating toward the sample; focusing the plurality of electron beams on the sample at a plurality of probe positions (106) in a two-dimensional array; scanning the sample surface by moving the movable stage in a predetermined scanning pattern while maintaining the plurality of electron beams stationary; and detecting signal electrons emitted from the sample during the movement of the movable stage for inspecting the sample. Further, a multi-electron beam inspection system (100) for inspecting a sample according to the above method is described.

    METHOD AND APPARATUS FOR INSPECTING A SAMPLE
    2.
    发明申请
    METHOD AND APPARATUS FOR INSPECTING A SAMPLE 审中-公开

    公开(公告)号：US20180364563A1

    公开(公告)日：2018-12-20

    申请号：US15628235

    申请日：2017-06-20

    Applicant: Applied Materials, Inc.

    Inventor： Kulpreet Singh VIRDI ,  Bernhard G. MUELLER

    IPC: G03F1/86 ,  G01N21/956 ,  H01J37/28 ,  H01J37/304 ,  H01J37/244

    Abstract: A method of inspecting a sample is described which includes a multilevel structure with a first layer that is arranged above a second layer. The method includes: arranging the sample in a vacuum chamber; directing a primary electron beam onto the sample such that first primary electrons of the primary electron beam are backscattered by the first layer to form first backscattered electrons and second primary electrons of the primary electron beam are backscattered by the second layer to form second backscattered electrons; and detecting signal electrons comprising the first backscattered electrons and the second backscattered electrons for obtaining spatial information on both the first layer and the second layer. Further, an apparatus including one or more electron microscopes for inspecting a sample including a multilevel structure is described.

    METHODS AND APPARATUSES FOR TESTING ELECTRICAL CONNECTIONS OF A SUBSTRATE
    3.
    发明申请
    METHODS AND APPARATUSES FOR TESTING ELECTRICAL CONNECTIONS OF A SUBSTRATE 有权

    公开(公告)号：US20250164580A1

    公开(公告)日：2025-05-22

    申请号：US18839597

    申请日：2022-04-05

    Applicant: Applied Materials, Inc.

    Inventor： Axel WENZEL ,  Ludwig LEDL ,  Bernhard G. MUELLER

    IPC: G01R31/66

    Abstract: A method for testing electrical connections of a substrate is described, the substrate having a first surface contact and a first electrical connection extending from the first surface contact. The method includes: (a) discharging the first surface contact by focusing and deflecting a first electron beam having a first electron energy on the first surface contact; (b) charging the first surface contact by focusing and deflecting a second electron beam having a second electron energy different from the first electron energy on the first surface contact; and (c) inspecting the first electrical connection by detecting signal electrons emitted from the substrate. Further described are apparatuses for testing electrical connections of a substrate using two electron beams of different electron energies in accordance with the methods described herein.

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