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公开(公告)号：US20250045900A1
公开(公告)日：2025-02-06
申请号：US18922194
申请日：2024-10-21
Applicant: Applied Materials, Inc.
Inventor： Yash Chhabra , Abyaya Dhar , Joseph Liu , Yi Nung Wu , Boon Sen Chan , Sidda Reddy Kurakula , Chandrasekhar Roy
Abstract: A method includes identifying one or more images of an edge of a susceptor pocket formed in an upper surface of a susceptor of a substrate processing system. An angle identification component is disposed in the susceptor pocket. The method further includes causing, based on the one or more images, performance of an action associated with the susceptor.
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2.发明授权公开(公告)号：US11898245B2
公开(公告)日：2024-02-13
申请号：US17187218
申请日：2021-02-26
Applicant: Applied Materials, Inc.
Inventor： Chien-Min Liao , Chi-Feng Liu , Yi Nung Wu , Hsiu Yang , Yixing Lin , Boon Sen Chan , Siamak Salimian
IPC: C23C16/44 , C23C16/455 , H05B1/02
CPC classification number: C23C16/4405 , C23C16/4412 , C23C16/45565 , H05B1/0233
Abstract: Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.
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公开(公告)号：USD1027120S1
公开(公告)日：2024-05-14
申请号：US29762536
申请日：2020-12-17
Applicant: Applied Materials, Inc.
Designer： Yao-Hung Yang , Eric Ruhland , Saurabh M. Chaudhari , Dien-Yeh Wu , Philip Wayne Nagle , Aniruddha Pal , Sudhir R. Gondhalekar , Siamak Salimian , Scott Lin , Boon Sen Chan
Abstract: FIG. 1 is top perspective view of a seal for an assembly in a vapor deposition chamber.
FIG. 2 is a bottom perspective view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
FIG. 3 is a top plan view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
FIG. 4 is a bottom plan view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
FIG. 5 is a front view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
FIG. 6 is a rear view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
FIG. 7 is a right side view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
FIG. 8 is a left side view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
FIG. 9 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1 showing details of an outer segment of the seal.
FIG. 10 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1 showing details of a central segment of the seal.
FIG. 11 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1 showing details of an outer segment of the seal.
FIG. 12 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 2 showing details of an outer segment of the seal.
FIG. 13 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 3 showing details of a central segment of the seal.
FIG. 14 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 4 showing details of a central segment of the seal.
FIG. 15 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 6 showing details of an outer segment of the seal.
FIG. 16 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 7 showing details of an outer segment of the seal; and,
FIG. 17 is a top plan view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 3 shown in a portion of an assembly (in phantom).
The broken and phantom lines in the Figures illustrate unclaimed parts of the seal for an assembly in a vapor deposition chamber and form no part of the claimed design.-
Patent Agency Ranking
公开(公告)号：US12136225B2
公开(公告)日：2024-11-05
申请号：US17941914
申请日：2022-09-09
Applicant: Applied Materials, Inc.
Inventor： Yash Chhabra , Abyaya Dhar , Boon Sen Chan , Yenwei Hung , Sidda Reddy Kurakula , Chandrasekhar Roy , Chih Chuan Wang
Abstract: A method includes identifying an image of a substrate processing equipment part that forms a plurality of holes. The method further includes determining, by a processing device based on the image, a corresponding neighboring angular distance of each of the plurality of holes and a corresponding area of each of the plurality of holes. The method further includes identifying, by the processing device, a first subset of the plurality of holes that are at least partially clogged based on at least one of the corresponding neighboring angular distance or the corresponding area of each of the plurality of holes. A corrective action associated with the substrate processing equipment part is to be performed based on the first subset of the plurality of holes that are at least partially clogged.
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公开(公告)号：US20240095899A1
公开(公告)日：2024-03-21
申请号：US17949937
申请日：2022-09-21
Applicant: Applied Materials, Inc.
Inventor： Yash Chhabra , Abyaya Dhar , Joseph Liu , Yi Nung Wu , Boon Sen Chan , Sidda Reddy Kurakula , Chandrasekhar Roy
CPC classification number: G06T7/0004 , G01N21/9501 , G06T2207/20081 , G06T2207/20084 , G06T2207/30148
Abstract: The present disclosure includes edge defect detection via image analytics. A method includes identifying an image of an edge of a susceptor pocket formed by a susceptor of a substrate processing system. The method further includes predicting, based on the image, whether property values of the edge of the susceptor meet threshold values. The method further includes, responsive to the property values of the edge meeting threshold values, causing performance of a corrective action associated with the susceptor.
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公开(公告)号：US20250045932A1
公开(公告)日：2025-02-06
申请号：US18922790
申请日：2024-10-22
Applicant: Applied Materials, Inc.
Inventor： Yash Chhabra , Abyaya Dhar , Boon Sen Chan , Yenwei Hung , Sidda Reddy Kurakula , Chandrasekhar Roy , Chih Chuan Wang
Abstract: A method includes determining, by a processing device based on an image of a substrate processing equipment part that forms holes, a clockwise holes spiral and an anti-clockwise holes spiral of the holes. The method further includes identifying, by the processing device, a first subset of the holes in at least one of the clockwise holes spiral or the anti-clockwise holes spiral that are at least partially clogged. A corrective action associated with the substrate processing equipment part is to be performed based on the first subset of the holes that are at least partially clogged.
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公开(公告)号：US12211195B2
公开(公告)日：2025-01-28
申请号：US17949937
申请日：2022-09-21
Applicant: Applied Materials, Inc.
Inventor： Yash Chhabra , Abyaya Dhar , Joseph Liu , Yi Nung Wu , Boon Sen Chan , Sidda Reddy Kurakula , Chandrasekhar Roy
Abstract: The present disclosure includes edge defect detection via image analytics. A method includes identifying an image of an edge of a susceptor pocket formed by a susceptor of a substrate processing system. The method further includes predicting, based on the image, whether property values of the edge of the susceptor meet threshold values. The method further includes, responsive to the property values of the edge meeting threshold values, causing performance of a corrective action associated with the susceptor.
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公开(公告)号：US20240087135A1
公开(公告)日：2024-03-14
申请号：US17941914
申请日：2022-09-09
Applicant: Applied Materials, Inc.
Inventor： Yash Chhabra , Abyaya Dhar , Boon Sen Chan , Yenwei Hung , Sidda Reddy Kurakula , Chandrasekhar Roy , Chih Chuan Wang
CPC classification number: G06T7/194 , G06T7/0004 , G06T2207/30164
Abstract: A method includes identifying an image of a substrate processing equipment part that forms a plurality of holes. The method further includes determining, by a processing device based on the image, a corresponding neighboring angular distance of each of the plurality of holes and a corresponding area of each of the plurality of holes. The method further includes identifying, by the processing device, a first subset of the plurality of holes that are at least partially clogged based on at least one of the corresponding neighboring angular distance or the corresponding area of each of the plurality of holes. A corrective action associated with the substrate processing equipment part is to be performed based on the first subset of the plurality of holes that are at least partially clogged.
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