公开(公告)号：US12061422B2

公开(公告)日：2024-08-13

申请号：US17157634

申请日：2021-01-25

Applicant: Applied Materials, Inc.

Inventor： Benjamin M. Johnston ,  Preston Fung ,  Sean Screws ,  Cheuk Ming Lee ,  Jae Myung Yoo

IPC: G03F7/00

CPC classification number: G03F7/7075 ,  G03F7/707 ,  G03F7/70716 ,  G03F7/70758 ,  G03F7/70775 ,  G03F7/70791

Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

公开(公告)号：US10901328B2

公开(公告)日：2021-01-26

申请号：US16146054

申请日：2018-09-28

Applicant: Applied Materials, Inc.

Inventor： Benjamin M. Johnston ,  Preston Fung ,  Sean Screws ,  Cheuk Ming Lee ,  Jae Myung Yoo

IPC: G03F7/20

Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

公开(公告)号：US11009801B2

公开(公告)日：2021-05-18

申请号：US17035105

申请日：2020-09-28

Applicant: Applied Materials, Inc.

Inventor： Benjamin M. Johnston ,  David Michael Corriveau ,  Cheuk Ming Lee ,  Jae Myung Yoo ,  WeiMin Tao ,  Antoine P. Manens

IPC: G03F7/20

Abstract: Embodiments described herein provide a system, a software application, and methods of a lithography process that provide at least one of the ability to decrease the stabilization time and write an exposure pattern into a photoresist on a substrate compensating for the change in the total pitch over a stabilization time. One embodiment of the system includes a slab, a stage disposed over the slab, a pair of supports disposed on the slab, a processing apparatus, and a chiller system. The pair of supports support a pair of tracks and the stage is configured to move along the pair of tracks. The processing apparatus has an apparatus support coupled to the slab and a processing unit supported by the apparatus support. The processing unit has a plurality of image projection systems. The chiller system has at least one fluid channel disposed in each track of the pair of tracks.

公开(公告)号：US10788762B2

公开(公告)日：2020-09-29

申请号：US16284516

申请日：2019-02-25

Applicant: Applied Materials, Inc.

Inventor： Benjamin M. Johnston ,  David Michael Corriveau ,  Cheuk Ming Lee ,  Jae Myung Yoo ,  WeiMin Tao ,  Antoine P. Manens

IPC: G03F7/20

Abstract: Embodiments described herein provide a system, a software application, and methods of a lithography process that provide at least one of the ability to decrease the stabilization time and write an exposure pattern into a photoresist on a substrate compensating for the change in the total pitch over a stabilization time. One embodiment of the system includes a slab, a stage disposed over the slab, a pair of supports disposed on the slab, a processing apparatus, and a chiller system. The pair of supports support a pair of tracks and the stage is configured to move along the pair of tracks. The processing apparatus has an apparatus support coupled to the slab and a processing unit supported by the apparatus support. The processing unit has a plurality of image projection systems. The chiller system has at least one fluid channel disposed in each track of the pair of tracks.