公开(公告)号：US20220384165A1

公开(公告)日：2022-12-01

申请号：US17333732

申请日：2021-05-28

Applicant: Applied Materials, Inc.

Inventor： Mengxue WU ,  Siew Kit HOI ,  Jay Min SOH ,  Yue CUI ,  Chul Nyoung LEE ,  Palaniappan CHIDAMBARAM ,  Jiao SONG

IPC: H01J37/34 ,  C23C14/35 ,  C23C14/54

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for processing a substrate comprises applying a DC target voltage to a target disposed within a processing volume of a plasma processing chamber, rotating a magnet disposed above the target at a default speed to direct sputter material from the target toward a substrate support disposed within the processing volume, measuring in-situ DC voltage in the processing volume, the in-situ DC voltage different from the DC target voltage, determining if a measured in-situ DC voltage is greater than a preset value, if the measured in-situ DC voltage is less than or equal to the preset value, maintaining the magnet at the default speed, and if the measured in-situ DC voltage is greater than the preset value, rotating the magnet at a speed less than the default speed to decrease the in-situ DC voltage.

公开(公告)号：US20220122871A1

公开(公告)日：2022-04-21

申请号：US17072082

申请日：2020-10-16

Applicant: APPLIED MATERIALS, INC.

Inventor： Yuichi WADA ,  Kok Wei TAN ,  Chul Nyoung LEE ,  Siew Kit HOI ,  Xinxin WANG ,  Zheng Min Clarence CHONG ,  Yaoying ZHONG ,  Kok Seong TEO

IPC: H01L21/683 ,  C23C4/134 ,  C23C14/34 ,  H01J37/32

Abstract: Methods and apparatus for protecting parts of a process chamber from thermal cycling effects of deposited materials. In some embodiments, a method of protecting the part of the process chamber includes wet etching the part with a weak alkali or acid, cleaning the part by bead blasting, coating at least a portion of a surface of the part with a stress relief layer. The stress relief layer forms a continuous layer that is approximately 50 microns to approximately 250 microns thick and is configured to preserve a structural integrity of the part from the thermal cycling of aluminum deposited on the part. The method may also include wet cleaning of the part with a heated deionized water rinse after formation of the stress relief layer.