公开(公告)号：US20220216450A1

公开(公告)日：2022-07-07

申请号：US17142853

申请日：2021-01-06

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Byung-Sung KWAK ,  Robert Jan VISSER

IPC: H01L51/56

Abstract: Embodiments of the present disclosure relate to an apparatus and methods for forming arrays of EL devices and forming the EL devices with overlapped mask plates. The methods utilize overlapping a first mask plate and a second mask plate to form a mask arrangement having first apertures of the first mask plate overlapped with second apertures of the second mask plate forming one or more opening areas. A material is evaporated through the mask arrangement such that layers of the material are formed in a device area of the EL devices. The device area of each of the EL devices corresponds to the opening area of the mask arrangement of the first mask plate and the second mask plate. The method described herein allows for a higher density of the EL devices and creates a smaller deposition area due to the opening area of the mask arrangement.

公开(公告)号：US20250107353A1

公开(公告)日：2025-03-27

申请号：US18977548

申请日：2024-12-11

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-Hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

公开(公告)号：US20230041252A1

公开(公告)日：2023-02-09

申请号：US17881358

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

公开(公告)号：US20220020951A1

公开(公告)日：2022-01-20

申请号：US17373939

申请日：2021-07-13

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Wan-Yu LIN ,  Gang YU ,  Byung-Sung KWAK ,  Robert Jan VISSER ,  Hyunsung BANG ,  Lisong XU ,  Chung-Chih WU ,  Hoang Yan LIN ,  Guo-Dong SU ,  YI-Jiun CHEN ,  Wei-Kai LEE

IPC: H01L51/52 ,  G09G3/3225 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56

Abstract: Embodiments described herein relate to graded slope bottom reflective electrode layer structures for top-emitting organic light-emitting diode (OLED) display pixels. An EL device includes a pixel definition layer having a top surface, a bottom surface, and graded sidewalls interconnecting the top and bottom surfaces and a bottom reflective electrode layer disposed over the pixel definition layer. The bottom reflective electrode layer includes a planar electrode portion disposed over the bottom surface and a graded reflective portion disposed over the graded sidewalls, where the graded reflective portion has a concave profile. The EL device includes an organic layer disposed over the bottom reflective electrode layer and a top electrode disposed over the organic layer. Also described herein are methods for fabricating the EL device.

公开(公告)号：US20220165995A1

公开(公告)日：2022-05-26

申请号：US17104188

申请日：2020-11-25

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Byung-sung Leo KWAK ,  Robert Jan VISSER

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/52

Abstract: Embodiments of the present disclosure generally relate to electroluminescent (EL) devices. More specifically, embodiments described herein relate to methods for forming arrays of the EL devices and selectively patterning a filler material in the EL devices. The EL device formed from the methods described herein will have improved outcoupling efficiency because of the patterned filler. The methods described herein pattern the filler and provide large area, low cost, and high resolution EL device formation by not relying on ink-jet printing or thermal evaporation with a fine metal mask.

公开(公告)号：US20240357873A1

公开(公告)日：2024-10-24

申请号：US18639882

申请日：2024-04-18

Applicant: Applied Materials, Inc.

Inventor： Yu-Hsin LIN ,  Chung-Chia CHEN ,  Takuji KATO ,  Ji Young CHOUNG

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K59/80521

Abstract: Embodiments described herein relate to sub-pixel circuits and for a display such as an organic light-emitting diode (OLED) display. In one embodiment, a device is provided. The device includes a substrate, two external pixel-defining layer (PDL) structures disposed over the substrate, an overhang opening defined by a top extensions of top structures disposed on and extending laterally past body structures, each body structure disposed over an upper surface of each external PDL structure, the overhang openings defining at least two sub-pixels including a first sub-pixel and a second sub-pixel, and at least one internal PDL structure disposed over the substrate, wherein the first sub-pixel and the second sub-pixel are connected over a top surface of the internal PDL structure with a first organic light-emitting diode (OLED) material of the first sub-pixel connecting a second OLED material of the second sub-pixel on the top surface of the internal PDL structure.

公开(公告)号：US20230263012A1

公开(公告)日：2023-08-17

申请号：US18139243

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-Hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K59/873

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

公开(公告)号：US20220029135A1

公开(公告)日：2022-01-27

申请号：US17371305

申请日：2021-07-09

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Byung-Sung KWAK ,  Robert Jan VISSER ,  Chung-Chih WU ,  Wei-Kai LEE ,  Po-Hsiang LIAO ,  Chang-Cheng LEE

IPC: H01L51/52 ,  H01L51/56 ,  H01L27/32

Abstract: Embodiments described herein relate to spatial optical differentiators and layer architecture of adjacent functional layers disposed above or below organic light-emitting diode (OLED) display pixels. A functional unit for an electroluminescent (EL) device pixel includes a spatial optical differentiator disposed adjacent the EL device pixel. The spatial optical differentiator is configured to selectively reflect and transmit light based on an incident angle of light upon the functional unit. For top-emitting OLED, the functional unit includes a thin film encapsulation (TFE) stack disposed over the spatial optical differentiator. For bottom-emitting OLED, the functional unit includes the spatial optical differentiator disposed above at least one of a planar layer or an isolation layer. Also described herein are methods for fabricating the functional unit.

公开(公告)号：US20240341125A1

公开(公告)日：2024-10-10

申请号：US18744244

申请日：2024-06-14

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Chung-Chia CHEN ,  Yu Hsin LIN ,  Jungmin LEE ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K71/16 ,  H10K102/10

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K71/16 ,  H10K2102/103

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

公开(公告)号：US20220344417A1

公开(公告)日：2022-10-27

申请号：US17389934

申请日：2021-07-30

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Chung-Chia CHEN ,  Yu Hsin LIN ,  Jungmin LEE ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/00

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.