公开(公告)号：US20230207358A1

公开(公告)日：2023-06-29

申请号：US17564511

申请日：2021-12-29

Applicant: Applied Materials, Inc.

Inventor： Coby Scott GROVE ,  Ruiping WANG ,  Avinash SHANTARAM ,  Jitendra Ratilal BHIMJIYANI

IPC: H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67303 ,  H01L21/67778

Abstract: Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

公开(公告)号：US20240194503A1

公开(公告)日：2024-06-13

申请号：US18586209

申请日：2024-02-23

Applicant: Applied Materials, Inc.

Inventor： Randy A. HARRIS ,  Coby Scott GROVE ,  Paul Zachary WIRTH ,  Avinash SHANTARAM ,  Alpay YILMAZ ,  Amir NISSAN ,  Jitendra Ratilal BHIMJIYANI ,  Niranjan PINGLE ,  Vincent DICAPRIO

IPC: H01L21/67 ,  H01L21/687 ,  H01L23/00

CPC classification number: H01L21/6719 ,  H01L21/67121 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67294 ,  H01L21/68707 ,  H01L24/97

Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates, wherein at least one of the plurality of automation modules include a bonder chamber and at least one of the plurality of automation modules include a wet clean chamber.

公开(公告)号：US20220262653A1

公开(公告)日：2022-08-18

申请号：US17513631

申请日：2021-10-28

Applicant: Applied Materials, Inc.

Inventor： Randy A. HARRIS ,  Coby Scott GROVE ,  Paul Zachary WIRTH ,  Avinash SHANTARAM ,  Alpay YILMAZ ,  Amir NISSAN ,  Jitendra Ratilal BHIMJIYANI ,  Niranjan PINGLE ,  Vincent Dicaprio

IPC: H01L21/67 ,  H01L21/687 ,  H01L23/00

Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.

公开(公告)号：US20220262652A1

公开(公告)日：2022-08-18

申请号：US17177882

申请日：2021-02-17

Applicant: Applied Materials, Inc.

Inventor： Randy A. HARRIS ,  Coby Scott GROVE ,  Paul Zachary WIRTH ,  Avinash SHANTARAM ,  Alpay YILMAZ ,  Amir NISSAN ,  Vincent DICAPRIO

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: Methods and apparatus bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing a substrate includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer configured to hold a plurality of the one or more types of substrates, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates between the buffer, the one or more process chambers, and a buffer disposed in an adjacent automation module of the plurality of automation modules.