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公开(公告)号:US20210249284A1
公开(公告)日:2021-08-12
申请号:US16789206
申请日:2020-02-12
Applicant: Applied Materials, Inc.
Inventor: Chaitanya A. PRASAD , Daniel C. GLOVER , Naman APURVA
IPC: H01L21/67 , H01L21/687 , F27D5/00 , B23K1/00
Abstract: A substrate support pedestal connectable to a shaft includes a thermally conductive body, a first fluid channel disposed within an outer zone of the thermally conductive body, and a second fluid channel disposed within an inner zone of the thermally conductive body. The first fluid channel and the second fluid channel are not in fluid communication with each other and are thermally isolated from each other by a thermal barrier within the substrate support channel.
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公开(公告)号:US20220157643A1
公开(公告)日:2022-05-19
申请号:US16952979
申请日:2020-11-19
Applicant: Applied Materials, Inc.
Inventor: Giridhar KAMESH , Vinodh RAMACHANDRAN , Chaitanya A. PRASAD , Mohammad AAMIR , Daniel C. GLOVER
IPC: H01L21/687 , H01L21/02 , H01L21/311
Abstract: Embodiments of the present disclosure generally relate to apparatus for substrate processing, and more specifically to apparatus for rotating substrates and to uses thereof. In an embodiment, an apparatus for rotating a substrate is provided. The apparatus includes a levitatable rotor comprising a plurality of magnets embedded therein, a plurality of gas bearings positioned to levitate the levitatable rotor, and a stator magnetically coupled to the levitatable rotor, the stator for producing a rotating magnetic field. Apparatus for processing a substrate with the apparatus for rotating substrates as well as methods of use are also described.
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3.
公开(公告)号:US20220415676A1
公开(公告)日:2022-12-29
申请号:US17362760
申请日:2021-06-29
Applicant: Applied Materials, Inc.
Inventor: Chaitanya Anjaneyalu PRASAD , Christopher Sean OLSEN , Lara HAWRYLCHAK , Erika Gabrielle HANSEN , Daniel C. GLOVER , Naman APURVA , Tsung-Han YANG
Abstract: Embodiments of gas distribution modules for use with rapid thermal processing (RTP) systems and methods of use thereof are provided herein. In some embodiments, a gas distribution module for use with a RTP chamber includes: a first carrier gas line and a first liquid line fluidly coupled to a mixer, the mixer having one or more control valves configured to mix a carrier gas from the first carrier gas line and a liquid from the first liquid line in a desired ratio to form a first mixture; a vaporizer coupled to the mixer and configured to receive the first mixture in a hollow internal volume, the vaporizer having a heater configured to vaporize the first mixture; and a first gas delivery line disposed between the vaporizer and the RTP chamber to deliver the vaporized first mixture to the RTP chamber.
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