公开(公告)号：US20190177869A1

公开(公告)日：2019-06-13

申请号：US15838009

申请日：2017-12-11

Applicant: Applied Materials, Inc.

Inventor： Paul McHugh ,  Gregory J. Wilson ,  Daniel Woodruff ,  Marvin Bernt

IPC: C25D17/00 ,  C25D7/12 ,  C25D17/12 ,  C25D21/12 ,  C25D5/04 ,  C25D17/06 ,  H01L21/288 ,  H01L21/687

Abstract: Embodiments of the present technology may include an electroplating system. The electroplating system may include a vessel. The system may also include a wafer holder configured for holding a wafer in the vessel. The system may further include an anode in the vessel. In addition, the method may include a plurality of thief electrodes. For each thief electrode of the plurality of thief electrodes, a thief current channel may be defined by a channel wall. The channel wall for each thief electrode may define an aperture adjacent to the wafer holder. The thief current channel may extend from each thief electrode to the aperture. The system may include a current control system in electrical communication with the plurality of thief electrodes. The current control system may be configured such that an amount of current delivered to each thief electrode can be adjusted independently.