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公开(公告)号:US20230009692A1
公开(公告)日:2023-01-12
申请号:US17368997
申请日:2021-07-07
Applicant: Applied Materials, Inc
Inventor: Songjae LEE , Hao WANG , David JORGENSEN , Yi-Chiau HUANG
IPC: C23C18/32 , C30B23/02 , C23C18/16 , C23C16/32 , C23C16/455 , C30B29/06 , C23C18/18 , C23C16/458
Abstract: Embodiments of the present disclosure generally relate to a substrate support having a two-part surface coating which reduces defect formation and back side metal contamination during substrate processing. A support body includes a body having an upper surface and a two-part coating disposed over the upper surface of the body. The two-part coating includes a first coating layer extending a first radial distance from a center of the body. The first coating layer includes at least one of a metal-containing material or alloy. The two-part coating includes a second coating layer disposed over the first coating layer. The second coating layer extends a second radial distance from the center of the body. The first radial distance is greater than the second radial distance. The second coating layer is non-metal.
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公开(公告)号:US20240141488A1
公开(公告)日:2024-05-02
申请号:US18050375
申请日:2022-10-27
Applicant: Applied Materials, Inc.
Inventor: David JORGENSEN , Songjae LEE , Hao WANG , Yi-Chiau HUANG , Christopher BEAUDRY
IPC: C23C16/455 , C23C16/08 , C23C18/16 , C23C18/32 , C23C28/00 , H01L21/687
CPC classification number: C23C16/45527 , C23C16/08 , C23C18/165 , C23C18/32 , C23C28/3455 , H01L21/68757
Abstract: Embodiments of the present disclosure generally relate to a substrate support having a surface coating which reduces defect formation and back side metal contamination during substrate processing. A support body includes a body having an outer surface and a surface coating formed from a non-metal or a reduced-metal material disposed over at least a top surface of the outer surface of the body. In an embodiment, the surface coating includes a two-part coating having an optional first coating layer formed over an entire outer surface of the support body.
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3.
公开(公告)号:US20230295789A1
公开(公告)日:2023-09-21
申请号:US17695475
申请日:2022-03-15
Applicant: Applied Materials, Inc.
Inventor: David JORGENSEN , Jian WU , Abhilash J. MAYUR
Abstract: This application generally relates to a chamber component for a thermal processing chamber comprising a base component having a coating disposed thereon, the coating having a base component having a coating disposed thereon, the coating includes a surface, a thickness, and a plurality of cracks extending from the surface of the coating through at least 40 percent of the thickness of the coating.
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