公开(公告)号：US20240210119A1

公开(公告)日：2024-06-27

申请号：US18597845

申请日：2024-03-06

Applicant: KMW INC.

Inventor： Kang Hyun LEE ,  Hyung Seok KIM ,  Hyung Gun IM

IPC: F28D15/04 ,  C23C18/16 ,  C23C18/18 ,  C23C18/32 ,  C23C28/02 ,  C25D3/38 ,  F28D15/02 ,  F28D21/00

CPC classification number: F28D15/046 ,  C23C18/1637 ,  C23C18/1648 ,  C23C18/165 ,  C23C18/1844 ,  C23C18/32 ,  C23C28/023 ,  C25D3/38 ,  F28D15/0233 ,  F28D2021/0029

Abstract: Disclosed herein are a vapor chamber and a method of producing the same. The vapor chamber includes a chamber body plate having one surface placed in close contact with a heating surface of a heating element and the other surface that is open, and having a refrigerant filling space filled with a refrigerant therein and defined to have a predetermined thickness, a chamber cover plate bonded to shield the other open surface of the chamber body plate, and a wick formed in the refrigerant filling space, which is a space between the chamber body plate and the chamber cover plate, and having at least multiple pores through which the refrigerant filled in the refrigerant filling space flows. The wick has the multiple pores formed through an electroless Ni plating process with aluminum powder filled in the refrigerant filling space, providing an advantage of simple manufacturing and excellent heat conduction performance.

公开(公告)号：US20240149337A1

公开(公告)日：2024-05-09

申请号：US18279660

申请日：2022-07-20

Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED

Inventor： Tomohiro FUKUURA

IPC: B22F1/18 ,  C23C18/16 ,  C23C18/44 ,  C23C22/02

CPC classification number: B22F1/18 ,  C23C18/1639 ,  C23C18/165 ,  C23C18/1658 ,  C23C18/44 ,  C23C22/02 ,  B22F2301/255 ,  B22F2302/256 ,  B22F2998/10

Abstract: The present invention provides a novel method for producing a structure comprising an assembly of metal-based particles. Provided is a method for producing a layered product, the layered product comprising a substrate having a three-dimensional surface; and a metal-based particle assembly layer arranged on the three-dimensional surface and comprising a plurality of metal-based particles arranged apart from each other, the method comprising the step of forming the metal-based particle assembly layer on the three-dimensional surface by immersing the substrate in a plating solution containing a cation of a metal constituting the metal-based particles to reduce the cation, wherein a VS/VL ratio of volume VS [cm3] of the substrate to volume VL [cm3] of the plating solution is 0.03 or less.

公开(公告)号：US11753734B2

公开(公告)日：2023-09-12

申请号：US17191409

申请日：2021-03-03

Applicant: California Institute of Technology

Inventor： Douglas C. Hofmann ,  Scott N. Roberts

IPC: C25D5/56 ,  C25D3/12 ,  C25D7/00 ,  B33Y10/00 ,  B33Y80/00 ,  C23C18/31 ,  C23C18/16 ,  B29C64/135 ,  B29C70/70 ,  B29D99/00 ,  B29C70/02 ,  B29C70/72 ,  B29K705/00 ,  B29L7/00

CPC classification number: C25D5/56 ,  B29C64/135 ,  B29C70/021 ,  B29C70/70 ,  B29C70/72 ,  B29D99/0089 ,  B33Y10/00 ,  B33Y80/00 ,  C23C18/165 ,  C23C18/31 ,  C25D3/12 ,  C25D7/00 ,  B29K2705/00 ,  B29L2007/002

Abstract: Systems and method for fabricating a metal core truss panel with seamlessly embedded features in accordance with embodiments of the invention are illustrated. One embodiment includes a method for producing a metal core truss panel composite, the method including fabricating a sacrificial core truss panel including a plurality of interconnected truss members and at least one embedded feature, and plating the sacrificial core truss panel with a layer of metal forming a metal core truss panel including a plurality of interconnected metal truss members and at least one seamlessly embedded metal feature.

公开(公告)号：US20230279553A1

公开(公告)日：2023-09-07

申请号：US18024097

申请日：2021-10-06

Applicant: Asahi Kasei Kabushiki Kaisha

Inventor： Tomoko Kozono ,  Toru Yumoto

IPC: C23C18/16 ,  C09D1/00 ,  C23C18/20 ,  C23C18/40 ,  B41M5/00

CPC classification number: C23C18/165 ,  C09D1/00 ,  C23C18/1689 ,  C23C18/2053 ,  C23C18/405 ,  B41M5/0047

Abstract: Provided is a method that is for manufacturing a conductive pattern-provided structure, that involves simple manufacturing steps, and that enables formation of a conductive pattern-provided structure having excellent interlayer adhesion. One mode of the present invention provides a method for manufacturing a conductive pattern-provided structure, the method comprising: a coating film formation step for obtaining a coating film by printing, on a base material, a dispersion that contains copper oxide-containing particles; and a plating step for performing electroless plating on the coating film by using a plating solution. The plating solution contains EDTA (ethylenediaminetetraacetic acid).

公开(公告)号：US11643730B2

公开(公告)日：2023-05-09

申请号：US16456634

申请日：2019-06-28

Applicant: Schlumberger Technology Corporation

Inventor： Manuel Marya ,  Virendra Singh

IPC: C23C18/16 ,  C23C18/31 ,  C23C18/18 ,  C25D5/36 ,  C25D5/38 ,  C25D9/02 ,  C25D5/10 ,  C25D3/04 ,  C25D3/12 ,  C25D9/04 ,  C23C28/00 ,  E21B43/12 ,  E21B34/06

CPC classification number: C23C18/165 ,  C23C18/1637 ,  C23C18/1824 ,  C23C18/31 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3455 ,  C23C28/44 ,  C25D3/04 ,  C25D3/12 ,  C25D5/10 ,  C25D5/36 ,  C25D5/38 ,  C25D9/02 ,  C25D9/04 ,  E21B34/06 ,  E21B43/123

Abstract: The disclosure provides for anti-scale deposition coatings for use on surface, such as on oilfield parts. The coating includes a first, sublayer of a metal, ceramic, or metal-ceramic composite, which is characterized in having a hardness in excess of 35 HRC. The coating includes a second, top layer over the first layer, that is a polymer. A surface of the first layer may be conditioned to have a roughened or patterned topology for receipt of and adherence with the at least one top layer. The first layer may provide the coating with hardness, and the at least one top layer may provide the coating with low-friction and anti-scale properties.

公开(公告)号：US20180274102A1

公开(公告)日：2018-09-27

申请号：US15698364

申请日：2017-09-07

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yusuke TANAKA ,  Atsushi HIENO ,  Tsutomu NAKANISHI ,  Yasuhito YOSHIMIZU ,  Akihiko HAPPOYA

IPC: C23C18/18 ,  C23C18/16 ,  C23C18/34 ,  C23C18/40 ,  C23F1/00 ,  C07D251/12 ,  H05K3/18

CPC classification number: C23C18/1893 ,  C07D251/12 ,  C23C18/1603 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1689 ,  C23C18/34 ,  C23C18/36 ,  C23C18/40 ,  C23F1/00 ,  G03F7/0002 ,  H01L21/288 ,  H01L21/76874 ,  H01L21/76885 ,  H05K3/00 ,  H05K3/184

Abstract: A method of forming a metal pattern includes forming a catalyst adsorption layer by bringing a surface of a substrate into contact with a solution, the substrate having a base region and a plurality of protrusions provided on the base region, the base region includes a first material, the protrusions includes a second material different from the first material, the first and the second material being exposed on the surface, and the solution containing a compound having a triazine skeleton, a first functional group of any one of a silanol group and an alkoxysilyl group, and a second functional group of at least one selected from the group consisting of an amino group, a thiol group, and an azido group, forming a catalyst layer on the catalyst adsorption layer, forming a metal film on the catalyst layer by an electroless plating method, and removing the metal film on the protrusions.

公开(公告)号：US20180171482A1

公开(公告)日：2018-06-21

申请号：US15895626

申请日：2018-02-13

Applicant: NIKON CORPORATION

Inventor： Shohei KOIZUMI ,  Yusuke KAWAKAMI

IPC: C23C18/16 ,  C23C18/18 ,  H05K3/18 ,  H05K3/24 ,  H01L51/00

CPC classification number: C23C18/1662 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1841 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/30 ,  H01L51/0021 ,  H01L51/0023 ,  H01L51/102 ,  H01L51/105 ,  H05K3/184 ,  H05K3/244

Abstract: It is an object to provide a technique for obtaining a wiring pattern by electroless plating without using a lift-off process. A method for manufacturing a wiring pattern characteristically includes: a base layer forming step of forming an base layer including a catalyst for electroless plating and a resin; a surface layer removing step of removing at least a part of a surface layer of the base layer; and a plating layer forming step of performing electroless plating and forming a plating layer on the base layer subjected to the surface layer removing step.

公开(公告)号：US20170356089A1

公开(公告)日：2017-12-14

申请号：US15360694

申请日：2016-11-30

Applicant: Colloidal Ink Co., Ltd.

Inventor： Masayuki Kanehara ,  Kei Kashizaki

IPC: C23C18/16 ,  C23C18/20 ,  C09D5/24 ,  C23C28/02 ,  B22F9/24 ,  C23C26/00 ,  C23C18/32 ,  C09D7/12 ,  C09D201/00 ,  C09D7/00 ,  C23C18/18 ,  C23C18/40 ,  B22F1/00

CPC classification number: C23C18/165 ,  B22F1/0022 ,  B22F9/24 ,  B22F2009/245 ,  B22F2301/255 ,  B22F2998/10 ,  B82Y30/00 ,  C08K3/08 ,  C08K3/20 ,  C08K5/3415 ,  C09D5/24 ,  C09D7/41 ,  C09D7/61 ,  C09D7/63 ,  C09D7/67 ,  C09D11/322 ,  C09D11/52 ,  C09D201/00 ,  C23C18/1641 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/32 ,  C23C18/405 ,  C23C26/00 ,  C23C28/023

Abstract: Provided is a composition for forming a plating base on which plating is applied without a pretreatment, especially any activation process for the plating base, conventionally believed to be necessary, as well as a thus-formed plating base and a method of forming a plating coat over the plating base. The plating base is a coating film formed by applying and drying a metal nanoparticle dispersion liquid or a metal nanoparticle dispersion ink in which metal nanoparticles are protected with a small amount of protecting agent. Thus, a metal film can be formed by plating without operations such as substrate cleaning or catalyst imparting and activating. Since it is not necessary to wash the substrate with acid or base solution or to heat-treat it at a high temperature, many variations of materials become available for the substrate.

公开(公告)号：US09828678B2

公开(公告)日：2017-11-28

申请号：US13497115

申请日：2010-09-20

Applicant: Frederic Fouda-Onana ,  Nicolas Guillet

Inventor： Frederic Fouda-Onana ,  Nicolas Guillet

IPC: C23C18/44 ,  C25D5/02 ,  C25D5/54 ,  C23C18/16 ,  C25D3/50 ,  H01M4/88

CPC classification number: C23C18/44 ,  C23C18/1644 ,  C23C18/165 ,  C25D3/50 ,  C25D5/02 ,  C25D5/54 ,  H01M4/8807 ,  H01M4/8842 ,  H01M4/8853

Abstract: The invention relates to a method for depositing a metal M1 onto a carbon layer, as well as to a method for manufacturing an electrode for fuel cells and to a method for manufacturing a fuel cell. The method for depositing a metal M1 onto a porous carbon layer according to the invention includes a step of depositing said metal M1 by means of the electrochemical reduction of an electrolytic solution of a salt of the metal M1, and, prior to said step of depositing the metal M1 by means of electrochemical reduction, a step of depositing a metal M2 by means of chemical reduction using a reducing gas of a salt of the metal M2, the thermodynamic equilibrium potential between the ionic form of the salt of M2 and M2, Eeqionic form of the salt of M2/M2 being greater than the thermodynamic equilibrium potential between the ionic form of the salt of M1 and M1, Eeqionic form of the salt of M1/M1. The invention can be used, in particular, in the field of fuel cells.

公开(公告)号：US09765251B2

公开(公告)日：2017-09-19

申请号：US14425415

申请日：2013-12-18

Applicant: UNIVERSITY OF SOUTH FLORIDA

Inventor： Jaspreet Dhau ,  Dharendra Goswami ,  Chand K. Jotshi ,  Elias K. Stefanakos

IPC: C09K5/00 ,  C09K5/06 ,  C23C18/16 ,  F28F21/06 ,  F28D20/02 ,  C23C18/31 ,  C25D7/00

CPC classification number: C09K5/063 ,  C09K5/00 ,  C23C18/1641 ,  C23C18/165 ,  C23C18/31 ,  C25D7/00 ,  F28D20/023 ,  F28F21/06 ,  F28F2225/00 ,  F28F2255/06 ,  Y02E60/145

Abstract: In one embodiment, a phase change material is encapsulated by forming a phase change material pellet, coating the pellet with flexible material, heating the coated pellet to melt the phase change material, wherein the phase change materials expands and air within the pellet diffuses out through the flexible material, and cooling the coated pellet to solidify the phase change material.