公开(公告)号：US20200086456A1

公开(公告)日：2020-03-19

申请号：US16552901

申请日：2019-08-27

Applicant: Applied Materials, Inc.

Inventor： Dmitry SKLYAR ,  Jeonghoon OH ,  Gerald J. ALONZO ,  Jonathan DOMIN ,  Steven M. ZUNIGA ,  Jay GURUSAMY

IPC: B24B49/04 ,  H01L21/321 ,  H01L21/67 ,  B24B37/005 ,  B24B57/04

Abstract: Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.