公开(公告)号：US10854425B2

公开(公告)日：2020-12-01

申请号：US15013795

申请日：2016-02-02

Applicant: Applied Materials, Inc.

Inventor： Chetan Mahadeswaraswamy ,  Walter R Merry ,  Sergio Fukuda Shoji ,  Chunlei Zhang ,  Yashaswini Pattar ,  Duy D Nguyen ,  Tina Tsong ,  Shane C Nevil ,  Douglas A Buchberger, Jr. ,  Fernando M Silveira ,  Brad L Mays ,  Kartik Ramaswamy ,  Hamid Noorbakhsh

IPC: H01J37/32 ,  G05B6/02 ,  H05H1/00

Abstract: Methods and systems for controlling temperatures in plasma processing chamber with reduced controller response times and increased stability. Temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. A feedforward control signal compensating disturbances in the temperature attributable to the plasma power may be combined with a feedback control signal counteracting error between a measured and desired temperature.

公开(公告)号：US11815816B2

公开(公告)日：2023-11-14

申请号：US17176108

申请日：2021-02-15

Applicant: Applied Materials, Inc.

Inventor： Douglas A Buchberger, Jr. ,  Dmitry Lubomirsky ,  John O. Dukovic ,  Srinivas D. Nemani

IPC: G03F7/38

CPC classification number: G03F7/38

Abstract: A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include an electrode assembly and a base assembly. The electrode assembly includes a permeable electrode. The base assembly includes one or more process fluid channels disposed around a circumference of the substrate support surface and configured to fill a process volume with a process fluid. The electrode assembly is configured to apply an electric field to a substrate disposed within the process volume.

公开(公告)号：US09358702B2

公开(公告)日：2016-06-07

申请号：US14139116

申请日：2013-12-23

Applicant: Applied Materials, Inc.

Inventor： Sumanth Banda ,  Jennifer Y. Sun ,  Douglas A Buchberger, Jr. ,  Shane C. Nevil

IPC: B23Q3/06 ,  B28D5/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC classification number: B28D5/0082 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6875 ,  H01L21/68757 ,  Y10T29/49826 ,  Y10T279/23

Abstract: An unseasoned substrate support assembly includes a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further includes an upper surface of the ceramic body having a first portion proximate to a center of the upper surface of the ceramic body and having a first roughness profile and a second portion distal from the center of the upper surface of the ceramic body and having a second roughness profile with a lower roughness than the first roughness profile, wherein areas of the first and second portions are based on radial distances from the center of the ceramic body.

Abstract translation: 未干燥的基板支撑组件包括陶瓷体和结合到陶瓷体的下表面的导热基体。 衬底支撑组件还包括陶瓷体的上表面，其具有靠近陶瓷体的上表面的中心的第一部分，并且具有第一粗糙度轮廓和远离陶瓷上表面中心的第二部分 并且具有比第一粗糙度轮廓更低的粗糙度的第二粗糙度轮廓，其中第一和第二部分的区域基于距陶瓷体的中心的径向距离。