公开(公告)号：US20220189749A1

公开(公告)日：2022-06-16

申请号：US17120721

申请日：2020-12-14

Applicant: Applied Materials, Inc.

Inventor： Ribhu Gautam ,  Vibhu Jindal ,  Kamatchi Gobinath Manoharan ,  Sanjay Bhat ,  Praveen Kumar Choragudi ,  Wen Xiao ,  Vinodh Ramachandran

IPC: H01J37/32 ,  C23C14/34

Abstract: An ex situ physical vapor deposition (PVD) process kit conditioning apparatus configured to condition process kit components of a PVD substrate processing chamber, the ex situ PVD process kit conditioning apparatus comprising a chamber assembly, a central cathode assembly configured to mount one or more targets. The apparatus is configured to receive one or more components of a process kit of a PVD substrate processing chamber and the central cathode assembly is positioned and configured so that the apparatus deposits the defect reduction coating substantially uniformly on an inner surface of a process kit component of the PVD substrate processing chamber.