公开(公告)号：US12237186B2

公开(公告)日：2025-02-25

申请号：US17945910

申请日：2022-09-15

Applicant: Applied Materials, Inc.

Inventor： Ruiping Wang ,  Ying Wang ,  Guan Huei See ,  Ananthkrishna Jupudi ,  Praveen Kumar Choragudi

IPC: H01L21/67 ,  B08B1/10 ,  B08B3/04 ,  B08B7/00 ,  B08B13/00 ,  F26B25/14 ,  G06T1/00 ,  H01L21/683

Abstract: Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.

公开(公告)号：US20220189749A1

公开(公告)日：2022-06-16

申请号：US17120721

申请日：2020-12-14

Applicant: Applied Materials, Inc.

Inventor： Ribhu Gautam ,  Vibhu Jindal ,  Kamatchi Gobinath Manoharan ,  Sanjay Bhat ,  Praveen Kumar Choragudi ,  Wen Xiao ,  Vinodh Ramachandran

IPC: H01J37/32 ,  C23C14/34

Abstract: An ex situ physical vapor deposition (PVD) process kit conditioning apparatus configured to condition process kit components of a PVD substrate processing chamber, the ex situ PVD process kit conditioning apparatus comprising a chamber assembly, a central cathode assembly configured to mount one or more targets. The apparatus is configured to receive one or more components of a process kit of a PVD substrate processing chamber and the central cathode assembly is positioned and configured so that the apparatus deposits the defect reduction coating substantially uniformly on an inner surface of a process kit component of the PVD substrate processing chamber.

公开(公告)号：US11860528B2

公开(公告)日：2024-01-02

申请号：US17129077

申请日：2020-12-21

Applicant: Applied Materials, Inc.

Inventor： Ribhu Gautam ,  Vibhu Jindal ,  Sanjay Bhat ,  Praveen Kumar Choragudi ,  Vinodh Ramachandran ,  Arun Rengaraj

IPC: H01L21/67 ,  G03F1/24 ,  H01L21/687 ,  B65G47/90 ,  C23C14/06 ,  C23C14/56 ,  C23C14/58 ,  C23C14/35

CPC classification number: G03F1/24 ,  B65G47/90 ,  C23C14/0641 ,  C23C14/35 ,  C23C14/566 ,  C23C14/568 ,  C23C14/5806 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/68764

Abstract: Substrate processing systems or platforms and methods configured to process substrates including of extreme ultraviolet (EUV) mask blanks are disclosed. Systems or platforms provide a small footprint, high throughput of substrates and minimize defect generation. The substrate processing system platform comprises a single central transfer chamber, a single transfer robot, a substrate flipping fixture, and processing chambers are positioned around the single central transfer chamber.

公开(公告)号：US20220197128A1

公开(公告)日：2022-06-23

申请号：US17129077

申请日：2020-12-21

Applicant: Applied Materials, Inc.

Inventor： Ribhu Gautam ,  Vibhu Jindal ,  Sanjay Bhat ,  Praveen Kumar Choragudi ,  Vinodh Ramachandran ,  Arun Rengaraj

IPC: G03F1/24 ,  H01L21/67 ,  H01L21/687 ,  C23C14/06 ,  C23C14/56 ,  C23C14/58 ,  C23C14/35 ,  B65G47/90

Abstract: Substrate processing systems or platforms and methods configured to process substrates including of extreme ultraviolet (EUV) mask blanks are disclosed. Systems or platforms provide a small footprint, high throughput of substrates and minimize defect generation. The substrate processing system platform comprises a single central transfer chamber, a single transfer robot, a substrate flipping fixture, and processing chambers are positioned around the single central transfer chamber.