公开(公告)号：US20230005783A1

公开(公告)日：2023-01-05

申请号：US17940369

申请日：2022-09-08

申请人： Applied Materials, Inc.

发明人： Jason M. Schaller ,  Luke Bonecutter ,  Charles T. Carlson ,  Rajkumar Thanu ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

IPC分类号： H01L21/687 ,  B65G47/90 ,  H01L21/67

摘要： Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.

公开(公告)号：US11326256B2

公开(公告)日：2022-05-10

申请号：US16691259

申请日：2019-11-21

申请人： Applied Materials, Inc.

发明人： Luke Bonecutter ,  Yunzhe Yang ,  Rupankar Choudhury ,  Abhijit Kangude

IPC分类号： C23C16/455 ,  C23C16/458 ,  C23C16/44

摘要： Embodiments described herein relate to apparatus and techniques for mechanical isolation and thermal insulation in a process chamber. In one embodiment, an insulating layer is disposed between a dome assembly and a gas ring. The insulating layer is configured to maintain a temperature of the dome assembly and prevent thermal energy transfer from the dome assembly to the gas ring. The insulating layer provides mechanical isolation of the dome assembly from the gas ring. The insulating layer also provides thermal insulation between the dome assembly and the gas ring. The insulating layer may be fabricated from a polyimide containing material, which substantially reduces an occurrence of deformation of the insulating layer.

公开(公告)号：US11355367B2

公开(公告)日：2022-06-07

申请号：US16922536

申请日：2020-07-07

申请人： Applied Materials, Inc.

发明人： Jason M. Schaller ,  Charles T. Carlson ,  Luke Bonecutter ,  David Blahnik ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

IPC分类号： H01L21/67 ,  B65G47/90 ,  H01L21/687 ,  H01L21/68

摘要： Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.

公开(公告)号：US10984990B2

公开(公告)日：2021-04-20

申请号：US15955290

申请日：2018-04-17

申请人： Applied Materials, Inc.

发明人： Ramesh Bokka ,  Jason M. Schaller ,  Jay D. Pinson, II ,  Luke Bonecutter

IPC分类号： H01J37/32 ,  C23C16/458 ,  C23C16/50 ,  H01L21/67 ,  H01L21/683 ,  C23C16/503 ,  C23C16/517 ,  C23C16/509 ,  C23C16/46

摘要： A plasma processing apparatus is provided including a radio frequency power source; a direct current power source; a chamber enclosing a process volume; and a substrate support assembly disposed in the process volume. The substrate support assembly includes a substrate support having a substrate supporting surface; an electrode disposed in the substrate support; and an interconnect assembly coupling the radio frequency power source and the direct current power source with the electrode.

公开(公告)号：US11443973B2

公开(公告)日：2022-09-13

申请号：US16922727

申请日：2020-07-07

申请人： Applied Materials, Inc.

发明人： Jason M. Schaller ,  Luke Bonecutter ,  Charles T. Carlson ,  Rajkumar Thanu ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

IPC分类号： H01L21/68 ,  H01L21/687 ,  B65G47/90 ,  H01L21/67

摘要： Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.

公开(公告)号：US11227746B2

公开(公告)日：2022-01-18

申请号：US16980931

申请日：2019-02-20

申请人： Applied Materials, Inc.

发明人： Luke Bonecutter ,  Abhijit Kangude

IPC分类号： H01J37/32 ,  H01L21/67

摘要： Embodiments described herein provide a backside gas delivery assembly that prevents inert gas from forming parasitic plasma. The backside gas delivery assembly includes a first gas channel disposed in a stem of a substrate support assembly. The substrate support assembly includes a substrate support having a second gas channel extending from the first gas channel. The backside gas delivery assembly further includes a porous plug disposed within the first gas channel positioned at an interface of the stem and the substrate support, a gas source connected to the first gas channel configured to deliver an inert gas to a backside surface of a substrate disposed on an upper surface of the substrate support, and a gas tube in the first gas channel extending to the porous plug positioned at the interface of the stem and the substrate support.

公开(公告)号：US20210013084A1

公开(公告)日：2021-01-14

申请号：US16922727

申请日：2020-07-07

申请人： Applied Materials, Inc.

发明人： Jason M. Schaller ,  Luke Bonecutter ,  Charles T. Carlson ,  Rajkumar Thanu ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

IPC分类号： H01L21/687 ,  H01L21/67 ,  B65G47/90

摘要： Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.

公开(公告)号：US20230032854A1

公开(公告)日：2023-02-02

申请号：US17965491

申请日：2022-10-13

申请人： Applied Materials, Inc.

发明人： Charles T. Carlson ,  Jason M. Schaller ,  Luke Bonecutter ,  David Blahnik

IPC分类号： H01L21/67 ,  B65G47/90 ,  H01L21/687 ,  H01L21/68

摘要： Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.

公开(公告)号：US11476135B2

公开(公告)日：2022-10-18

申请号：US16922447

申请日：2020-07-07

申请人： Applied Materials, Inc.

发明人： Charles T. Carlson ,  Jason M. Schaller ,  Luke Bonecutter ,  David Blahnik

IPC分类号： H01L21/68 ,  H01L21/67 ,  B65G47/90 ,  H01L21/687

摘要： Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.

公开(公告)号：US20210013067A1

公开(公告)日：2021-01-14

申请号：US16922447

申请日：2020-07-07

申请人： Applied Materials, Inc.

发明人： Charles T. Carlson ,  Jason M. Schaller ,  Luke Bonecutter ,  David Blahnik

IPC分类号： H01L21/67 ,  B65G47/90 ,  H01L21/68 ,  H01L21/687

摘要： Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.