公开(公告)号：US09685655B2

公开(公告)日：2017-06-20

申请号：US14773146

申请日：2014-03-06

Applicant: Applied Materials, Inc.

Inventor： Fei C. Wang ,  Hooman Bolandi ,  Connie P. Wang ,  Victor Pebenito ,  Siqing Lu ,  Michael C. Kutney ,  Joseph G. Gordon ,  Robert Z. Bachrach

IPC: B05B5/025 ,  H01M4/04 ,  H01M4/139 ,  H01M4/1391 ,  B05B13/02 ,  H01M4/1393 ,  H01M4/1395 ,  H01M4/1397 ,  H01M4/36

CPC classification number: H01M4/0419 ,  B05B5/025 ,  B05B13/0221 ,  H01M4/0404 ,  H01M4/139 ,  H01M4/1391 ,  H01M4/1393 ,  H01M4/1395 ,  H01M4/1397 ,  H01M4/366

Abstract: A method and apparatus for forming battery active material on a substrate are disclosed. In one embodiment, an apparatus for depositing a battery active material on a surface of a substrate includes a substrate conveyor system for transporting the substrate within the apparatus, a material spray assembly disposed above the substrate conveyor system, and a first heating element disposed adjacent to the material spray assembly above the substrate conveyor system configured to heat the substrate. The material spray assembly has a 2-D array of nozzles configured to electrospray an electrode forming solution on the surface of the substrate.

公开(公告)号：US20150204606A1

公开(公告)日：2015-07-23

申请号：US14601645

申请日：2015-01-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael C. Kutney

IPC: F26B3/28 ,  B08B5/00

CPC classification number: F26B3/283 ,  H01L21/67109

Abstract: Embodiments of methods and apparatus for processing a substrate are provided herein. In some embodiments, an apparatus for processing a substrate includes a non-vacuum enclosure; at least one opening in the non-vacuum enclosure to insert a substrate into or remove a substrate from the non-vacuum enclosure; a movable substrate carrier, including a plurality of substrate holders, disposed within the non-vacuum enclosure to linearly move substrates disposed on the plurality of substrate holders; a heater to heat an interior of the non-vacuum enclosure; a gas supply to supply a gas to the interior of the non-vacuum enclosure; and a vent to exhaust the gas from the interior of the non-vacuum enclosure.

Abstract translation: 本文提供了用于处理基板的方法和装置的实施例。 在一些实施例中，用于处理衬底的设备包括非真空外壳; 所述非真空外壳中的至少一个开口将基板插入所述非真空外壳中或从所述非真空外壳中移除基板; 可移动的衬底载体，包括设置在所述非真空外壳内的多个衬底保持件，以直线移动设置在所述多个衬底保持器上的衬底; 用于加热非真空外壳内部的加热器; 用于向非真空外壳的内部供应气体的气体供应; 以及从非真空外壳的内部排出气体的排气口。

公开(公告)号：US09982786B2

公开(公告)日：2018-05-29

申请号：US14291828

申请日：2014-05-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael C. Kutney

IPC: F16K1/52 ,  F16K37/00 ,  C23C16/44 ,  C23C16/455

CPC classification number: F16K1/523 ,  C23C16/4412 ,  C23C16/45561 ,  F16K37/0041 ,  Y10T29/49407

Abstract: Embodiments of valves having adjustable hard stops and methods of use thereof are provided herein. The adjustable valve includes a valve body including an inlet and an outlet; a valve member that is moveable between a fully closed position and a fully open position to selectively allow or prevent flow from the inlet to the outlet; and an adjustable hard stop to limit the fully open position of the valve to an adjusted fully open position.

公开(公告)号：US11054184B2

公开(公告)日：2021-07-06

申请号：US16361196

申请日：2019-03-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael C. Kutney

IPC: F26B3/28 ,  H01L21/67

Abstract: Embodiments of methods and apparatus for processing a substrate are provided herein. In some embodiments, a method of treating a substrate includes placing a substrate onto one of a plurality of substrate holders of a movable substrate carrier within a non-vacuum enclosure of a substrate treatment apparatus; heating the interior of the non-vacuum enclosure; supplying a gas into the non-vacuum enclosure to react with a surface of the substrate; and exhausting the gas from the non-vacuum enclosure through a vent in the non-vacuum enclosure.

公开(公告)号：US10247473B2

公开(公告)日：2019-04-02

申请号：US14601645

申请日：2015-01-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael C. Kutney

IPC: F26B3/28 ,  H01L21/67

Abstract: Embodiments of methods and apparatus for processing a substrate are provided herein. In some embodiments, an apparatus for processing a substrate includes a non-vacuum enclosure; at least one opening in the non-vacuum enclosure to insert a substrate into or remove a substrate from the non-vacuum enclosure; a movable substrate carrier, including a plurality of substrate holders, disposed within the non-vacuum enclosure to linearly move substrates disposed on the plurality of substrate holders; a heater to heat an interior of the non-vacuum enclosure; a gas supply to supply a gas to the interior of the non-vacuum enclosure; and a vent to exhaust the gas from the interior of the non-vacuum enclosure.