专利检索 ap:("Applied Materials, Inc.") AND inv:"Naushad Variam" 第 1 页

1.

发明公开
CARBON AND BORON IMPLANTATION FOR BACKSIDE CHEMICAL MECHANICAL PLANARIZATION CONTROL 审中-公开

公开(公告)号：US20240266175A1

公开(公告)日：2024-08-08

申请号：US18105302

申请日：2023-02-03

申请人： Applied Materials, Inc.

发明人： Yan Zhang , Johannes M. van Meer , Jae Young Lee , Naushad Variam

IPC分类号： H01L21/265 , H01L21/306 , H01L21/768

CPC分类号： H01L21/26506 , H01L21/30625 , H01L21/76898

摘要： A method of processing a workpiece that will include a backside power delivery network is disclosed. The method includes forming a CMP marker layer in the workpiece at the depth to which the workpiece is to be thinned. This CMP marker layer, which may be a boron-rich layer, serves to slow the chemical-mechanical planarization (CMP) process. To minimize the diffusion of boron in this boron-rich layer, the boron-rich layer is sandwiched by implants of a first species of ions, where this first species of ions serves to slow the diffusion of the boron. In certain embodiments, carbon is used as the first species of ions.