SUBSTRATE CARRIER FOR A REDUCED TRANSMISSION OF THERMAL ENERGY
    1.
    发明申请
    SUBSTRATE CARRIER FOR A REDUCED TRANSMISSION OF THERMAL ENERGY 审中-公开
    用于减少热能传输的基板载体

    公开(公告)号:US20160276142A1

    公开(公告)日:2016-09-22

    申请号:US15031138

    申请日:2013-11-25

    Abstract: According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device includes a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion. The at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.

    Abstract translation: 根据本公开,提供了半导体衬底处理系统和衬底载体。 用于保持待处理的基板和用于在输送装置中或通过处理区域传送基板的基板载体包括用于保持基板的主要部分; 适于由所述运送装置支撑的第一端部; 以及将主要部分与第一端部连接起来的至少一个第一中间部分。 所述至少一个第一中间部分包括一个或多个切口,其适于减小主体部分和第一端部部分之间的热能传递。

    EVAPORATION SOURCE
    2.
    发明申请
    EVAPORATION SOURCE 审中-公开

    公开(公告)号:US20180245206A1

    公开(公告)日:2018-08-30

    申请号:US15557364

    申请日:2015-07-13

    CPC classification number: C23C14/243 C23C14/246 C23C16/4401 H01L2251/56

    Abstract: An evaporation source for a metal or a metal alloy is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the metal or metal alloy, a distribution pipe with one or more outlets provided along the length of the distribution pipe, wherein the distribution pipe is in fluid communication with the evaporation crucible, wherein the distribution pipe further comprises a first outer tube and a first inner tube, and wherein the distribution pipe and the evaporation crucible are provided as one single piece.

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