公开(公告)号：US20240139900A1

公开(公告)日：2024-05-02

申请号：US18101025

申请日：2023-01-24

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Jianshe Tang ,  Steven M. Zuniga ,  Brian J. Brown ,  Andrew J. Nagengast ,  Derek R. Witty ,  Rushabhkumar Desai ,  Shih-Haur Shen ,  Haosheng Wu ,  Yufei Hu

IPC: B24B37/005 ,  B24B37/04

CPC classification number: B24B37/005 ,  B24B37/042

Abstract: A chemical mechanical polishing apparatus has a platen to support a polishing pad, a carrier head comprising a rigid housing and configured to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish the substrate, an in-situ carrier head monitoring system including a sensor positioned to interact with the housing and to detect vibrational motion of the housing and generate signals based on the detected vibrational motion, and a controller. The controller is configured to generate a value for a carrier head status parameter based on received signals from the in-situ carrier head monitoring system, and change a polishing parameter or generate an alert based on the carrier head status parameter.