公开(公告)号：US20240066664A1

公开(公告)日：2024-02-29

申请号：US18363545

申请日：2023-08-01

Applicant: Applied Materials, Inc.

Inventor： Shou-Sung CHANG ,  Hui CHEN ,  Haosheng WU ,  Jianshe TANG ,  Sidney P. HUEY ,  Jeonghoon OH ,  Chad POLLARD ,  Chih Chung CHOU ,  Sameer A. DESHPANDE

IPC: B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

CPC classification number: B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

Abstract: The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad. The pad surface cleaning system may be used to spray the polishing surface with a high-pressure fluid spray to loosen debris from the polishing surface. The pad surface cleaning system may also be used to remove the loosened debris. Further, the pad surface cleaning system may isolate a conditioning disk from a polishing fluid to protect the conditioning disk from reacting with the polishing fluid.