公开(公告)号：US20220216074A1

公开(公告)日：2022-07-07

申请号：US17141622

申请日：2021-01-05

申请人： Applied Materials, Inc.

发明人： Jianshe TANG ,  Wei LU ,  Haosheng WU ,  Taketo SEKINE ,  Shou-Sung CHANG ,  Hari N. SOUNDARARAJAN ,  Chad POLLARD

IPC分类号： H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  B08B3/08 ,  B08B5/02 ,  B08B3/12 ,  H01L21/306

摘要： The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.

公开(公告)号：US20240359291A1

公开(公告)日：2024-10-31

申请号：US18139091

申请日：2023-04-25

申请人： Applied Materials, Inc.

发明人： Wei LU ,  Shih-Haur SHEN ,  David Maxwell GAGE ,  Jimin ZHANG ,  Taketo SEKINE ,  Haosheng WU ,  Kun XU ,  Jianshe TANG ,  Brian J. BROWN

IPC分类号： B24B49/10 ,  B24B37/34

CPC分类号： B24B49/10 ,  B24B37/345 ,  H01L21/68

摘要： A method of processing a substrate includes polishing a front surface of a substrate on a first pad coupled to a first platen. The method further includes transferring the substrate from the first pad to a second pad coupled to a second platen with a carrier head. The method further includes moving the carrier head to a scan position to place an edge of the substrate above an orientation sensor disposed at a rotational center of the second pad. The method further includes scanning the edge of the substrate with the orientation sensor to produce a signal. The method further includes analyzing the signal to locate a reference mark of the substrate to determine a rotational orientation of the substrate relative to the carrier head.

公开(公告)号：US20240047238A1

公开(公告)日：2024-02-08

申请号：US18381261

申请日：2023-10-18

申请人： Applied Materials, Inc.

发明人： Wei LU ,  Jimin ZHANG ,  Jianshe TANG ,  Brian J. BROWN

IPC分类号： H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC分类号： H01L21/67051 ,  H01L21/02087 ,  H01L21/68721 ,  H01L21/67248

摘要： The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US20240253183A1

公开(公告)日：2024-08-01

申请号：US18401306

申请日：2023-12-29

申请人： Applied Materials, Inc.

发明人： Priscilla Michelle Diep LAROSA ,  Haosheng WU ,  Jimin ZHANG ,  Taketo SEKINE ,  Chen-Wei CHANG ,  Jianshe TANG ,  Brian J. BROWN ,  Wei LU ,  Ekaterina A. MIKHAYLICHENKO ,  Huanbo ZHANG ,  Jeonghoon OH ,  Eric LAU ,  Andrew NAGENGAST ,  Takashi FUJIKAWA ,  Thomas H. OSTERHELD ,  Steven M. ZUNIGA

IPC分类号： B24B57/02 ,  B24B37/015 ,  B24B53/017

CPC分类号： B24B57/02 ,  B24B37/015 ,  B24B53/017

摘要： A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense fluid, such as a polishing fluid or water, and/or provide a vacuum pressure. The second fluid delivery arm is configured to dispense a fluid or vacuum pressure onto the polishing pad to effect the polishing rate at the edge of the substrate.

公开(公告)号：US20240066664A1

公开(公告)日：2024-02-29

申请号：US18363545

申请日：2023-08-01

申请人： Applied Materials, Inc.

发明人： Shou-Sung CHANG ,  Hui CHEN ,  Haosheng WU ,  Jianshe TANG ,  Sidney P. HUEY ,  Jeonghoon OH ,  Chad POLLARD ,  Chih Chung CHOU ,  Sameer A. DESHPANDE

IPC分类号： B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

CPC分类号： B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

摘要： The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad. The pad surface cleaning system may be used to spray the polishing surface with a high-pressure fluid spray to loosen debris from the polishing surface. The pad surface cleaning system may also be used to remove the loosened debris. Further, the pad surface cleaning system may isolate a conditioning disk from a polishing fluid to protect the conditioning disk from reacting with the polishing fluid.

公开(公告)号：US20230335418A1

公开(公告)日：2023-10-19

申请号：US18213717

申请日：2023-06-23

申请人： Applied Materials, Inc.

发明人： Jianshe TANG ,  Wei LU ,  Haosheng WU ,  Taketo SEKINE ,  Shou-Sung CHANG ,  Hari N. SOUNDARARAJAN ,  Chad POLLARD

IPC分类号： H01L21/67 ,  B08B3/02 ,  H01L21/306 ,  B08B3/12 ,  B08B3/08 ,  H01L21/02 ,  B08B5/02

CPC分类号： H01L21/67051 ,  B08B3/024 ,  H01L21/30625 ,  B08B3/12 ,  B08B3/08 ,  H01L21/02057 ,  B08B5/02 ,  B08B2230/01 ,  B08B2203/007 ,  H01L21/67109 ,  H01L21/02074

摘要： The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.

公开(公告)号：US20220193859A1

公开(公告)日：2022-06-23

申请号：US17127065

申请日：2020-12-18

申请人： Applied Materials, Inc.

发明人： Xingfeng WANG ,  Jianshe TANG ,  Feng Q. LIU ,  David M. GAGE ,  Stephen JEW

IPC分类号： B24B37/04 ,  B24B37/10 ,  B24B37/20 ,  B24B57/02

摘要： A polishing station for polishing a substrate using a polishing slurry is disclosed. The polishing station includes a substrate carrier having a substrate-receiving surface and a rotatable platen having a polishing pad disposed on a platen surface, where the polishing pad has a polishing surface facing the substrate-receiving surface. The polishing station includes an electromagnetic assembly disposed over the platen surface. The electromagnetic assembly includes an array of electromagnetic devices that are each operable to generate a magnetic field that is configured to pass through the polishing surface. The magnetic fields generated by the array of electromagnetic devices are oriented and configured to induce an electromagnetic force on a plurality of charged particles disposed in a polishing slurry disposed on the polishing surface. The applied magnetic field is configured to induce movement of the plurality of charged particles in a direction parallel or orthogonal to the polishing surface.