公开(公告)号：US20240066664A1

公开(公告)日：2024-02-29

申请号：US18363545

申请日：2023-08-01

Applicant: Applied Materials, Inc.

Inventor： Shou-Sung CHANG ,  Hui CHEN ,  Haosheng WU ,  Jianshe TANG ,  Sidney P. HUEY ,  Jeonghoon OH ,  Chad POLLARD ,  Chih Chung CHOU ,  Sameer A. DESHPANDE

IPC: B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

CPC classification number: B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

Abstract: The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad. The pad surface cleaning system may be used to spray the polishing surface with a high-pressure fluid spray to loosen debris from the polishing surface. The pad surface cleaning system may also be used to remove the loosened debris. Further, the pad surface cleaning system may isolate a conditioning disk from a polishing fluid to protect the conditioning disk from reacting with the polishing fluid.

公开(公告)号：US20170274495A1

公开(公告)日：2017-09-28

申请号：US15456413

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/10 ,  H01L21/687 ,  H01L21/67 ,  B24B37/20 ,  B24B57/02

CPC classification number: B24B37/10 ,  B24B37/20 ,  B24B57/02 ,  H01L21/67092 ,  H01L21/68785

Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

公开(公告)号：US20250073850A1

公开(公告)日：2025-03-06

申请号：US18811633

申请日：2024-08-21

Applicant: Applied Materials, Inc.

Inventor： Haosheng WU ,  Shou-Sung CHANG ,  Priscilla DIEP ,  Hui CHEN ,  Chih Chung CHOU ,  Jeonghoon OH ,  Jianshe TANG ,  Brian J. BROWN

IPC: B24B53/017 ,  H01L21/306

Abstract: A chemical mechanical polishing chamber may include a platen disposed within the chemical mechanical polishing chamber, the platen configured to support a polishing pad. The chamber may also include a slurry delivery arm configured to deliver a slurry to the polishing pad during a chemical mechanical polishing process. The chamber may include an arm may include one or more brackets, mechanically attached to an internal side of the chemical mechanical polishing chamber and positioned over the platen. The chamber may include a plurality of nozzles configured to deliver a gas to the polishing pad, the plurality of nozzles mechanically attached to the one or more brackets of the arm, each of the plurality of nozzles oriented such that an air gap is disposed between adjacent nozzles of the plurality of nozzles such that air may be pulled from the air gap and propelled with the gas towards the polishing pad.

公开(公告)号：US20200282506A1

公开(公告)日：2020-09-10

申请号：US16882154

申请日：2020-05-22

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Chih Chung CHOU ,  Charles C. GARRETSON ,  Jeonghoon OH ,  King Yi HEUNG

IPC: B24B7/22 ,  B24B13/005 ,  B24B37/07 ,  B24B49/10 ,  H01L21/3105 ,  H01L21/321

Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.

公开(公告)号：US20240042571A1

公开(公告)日：2024-02-08

申请号：US18381223

申请日：2023-10-18

Applicant: Applied Materials, Inc.

Inventor： Chih Chung CHOU ,  Anand Nilakantan IYER ,  Ekaterina A. MIKHAYLICHENKO ,  Christopher Heung-Gyun LEE ,  Erik RONDUM ,  Tiffany Yu-nung CHEUNG ,  Shou-Sung CHANG

IPC: B24B37/04 ,  H01L21/306

CPC classification number: B24B37/042 ,  H01L21/30625

Abstract: Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP apparatus for processing a substrate including a pad disposed on a platen. The pad has a pad radius and a central axis from which the pad radius extends. The apparatus also include a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly and a fluid delivery assembly comprising one or more nozzles, each nozzle coupled to a fast actuating valve.

公开(公告)号：US20180250788A1

公开(公告)日：2018-09-06

申请号：US15891722

申请日：2018-02-08

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Chih Chung CHOU ,  Charles C. GARRETSON ,  Jeonghoon OH ,  King Yi HEUNG

IPC: B24B7/22 ,  B24B13/005 ,  B24B49/10 ,  B24B37/07

CPC classification number: B24B7/228 ,  B24B13/005 ,  B24B37/07 ,  B24B49/10 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/3212 ,  H01L22/20

Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.

公开(公告)号：US20170274497A1

公开(公告)日：2017-09-28

申请号：US15456320

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Wei-Cheng LEE ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/26 ,  B24B37/30

CPC classification number: B24B37/26 ,  B24B37/30

Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.