公开(公告)号：US20240025010A1

公开(公告)日：2024-01-25

申请号：US18480060

申请日：2023-10-03

Applicant: Applied Materials, Inc.

Inventor： Puneet Narendra JAWALI ,  Nandan BARADANAHALLI KENCHAPPA ,  Jason G. FUNG ,  Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE ,  Rajeev BAJAJ ,  Adam Wade MANZONIE ,  Andrew Scott LAWING

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24B37/30

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24B37/30

Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.

公开(公告)号：US20230219189A1

公开(公告)日：2023-07-13

申请号：US17571336

申请日：2022-01-07

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGAM ,  Joshua CHEN ,  Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE ,  Daniel REDFIELD

IPC: B24B37/12 ,  B24B37/34

CPC classification number: B24B37/12 ,  B24B37/34

Abstract: Apparatus and methods for correcting asymmetry in a thickness profile by use of a Chemical Mechanical Planarization (CMP) process. In one embodiment, a CMP system includes a polishing pad, an adhesion layer, and a platen. The polishing pad includes has a polishing surface, a second surface that is positioned opposite to the polishing surface in a first direction, and a plurality of cavities formed in the second surface. The platen includes a body that comprises a pad supporting surface and one or more ports formed in the body, configured to receive a positive or negative pressure that is generated from a fluid control device. Each of the plurality of cavities is in fluid communication with at least one of the one or more ports and the adhesion layer is disposed between the pad supporting surface of the platen and a portion of the second surface of the polishing pad.

公开(公告)号：US20210394333A1

公开(公告)日：2021-12-23

申请号：US16906992

申请日：2020-06-19

Applicant: Applied Materials, Inc.

Inventor： Puneet Narendra JAWALI ,  Nandan BARADANAHALLI KENCHAPPA ,  Jason G. FUNG ,  Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE ,  Rajeev BAJAJ ,  Adam Wade MANZONIE ,  Andrew Scott LAWING

IPC: B24B37/24 ,  B24B37/26 ,  B24B37/22

Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.

公开(公告)号：US20230364735A1

公开(公告)日：2023-11-16

申请号：US18138502

申请日：2023-04-24

Applicant: Applied Materials, Inc.

Inventor： Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE ,  Ashwin CHOCKALINGAM

IPC: B24B37/22 ,  B24B37/04 ,  B24B37/24

CPC classification number: B24B37/22 ,  B24B37/042 ,  B24B37/24

Abstract: Embodiments of the disclosure include a polishing pad for planarizing a surface of a substrate during a polishing process. The polishing pad includes a base layer, comprising a first material composition, and a polishing layer disposed over the base layer. The polishing layer includes a second material composition that is exposed at a polishing surface of the polishing pad, wherein the polishing surface is configured to contact the surface of the substrate during the polishing process. The second material composition includes a polishing layer material having a hardness that is greater than 50 on a Shore D scale, a yield point strength, a yield point strength strain, a break point strength, and an elongation at break point strain, wherein a magnitude of a difference between the elongation at break point strain and the yield point strength strain is greater than the magnitude of yield point strength strain when measured at room temperature.

公开(公告)号：US20220395958A1

公开(公告)日：2022-12-15

申请号：US17346399

申请日：2021-06-14

Applicant: Applied Materials, Inc.

Inventor： Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE ,  Ashwin CHOCKALINGAM ,  Jason Garcheung FUNG ,  Veera Raghava Reddy KAKIREDDY ,  Nandan BARADANAHALLI KENCHAPPA ,  Puneet Narendra JAWALI ,  Rajeev BAJAJ

IPC: B24B37/26

Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.