公开(公告)号：US20240120229A1

公开(公告)日：2024-04-11

申请号：US17962410

申请日：2022-10-07

Applicant: Applied Materials, Inc.

Inventor： Shinichi OKI ,  Yuji AOKI ,  Trishul BYREGOWDA SHIVALINGAIAH

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: Embodiments of bipolar electrostatic chucks are provided herein. In some embodiments, a bipolar electrostatic chuck includes a ceramic plate; a plurality of electrodes disposed in the ceramic plate, wherein the plurality of electrodes include one or more positive electrodes arranged in a first pattern and one or more negative electrodes arranged in a second pattern; an aluminum base plate coupled to the ceramic plate; a positive conduit extending through the aluminum base plate and electrically coupled to the one or more positive electrodes, and a negative conduit extending through the aluminum base plate and electrically coupled to the one or more negative electrodes; and a first insulative tube disposed about each of the positive conduit and the negative conduit.

公开(公告)号：US20250116500A1

公开(公告)日：2025-04-10

申请号：US18378543

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Trishul BYREGOWDA SHIVALINGAIAH ,  Skanda Simha CHANDRASHEKAR ,  Karthik Melinamane PRABHAKAR ,  Mahadev JOSHI ,  Peter F. DEMONTE

IPC: G01B9/02

Abstract: Embodiments of interferometric endpoint (IEP) housing assemblies for endpoint detection of plasma processing are provided herein. In some embodiments, IEP housing assemblies include: an IEP housing having an upper end configured to interface with a light source and having an internal cavity, wherein a lower end of the IEP housing is configured to interface with a dome assembly of a process chamber; a bracket having a body disposed about the IEP housing and having a plurality of arms extending radially outward from the body; and a plurality of biasing members extending from the body to the IEP housing and configured to hold the IEP housing within the body while allowing side-to-side deflection.