公开(公告)号：US20220084843A1

公开(公告)日：2022-03-17

申请号：US17022072

申请日：2020-09-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Manoj A. GAJENDRA ,  Kyle Moran HANSON ,  Mahadev JOSHI ,  Arvind THIYAGARAJAN ,  Jon Christian FARR

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/3065 ,  H01L21/677 ,  H01L21/687 ,  B08B3/08

Abstract: Methods and apparatus for removing substrate contamination are provided herein. In some embodiments, a multi-chamber processing apparatus includes: a processing chamber for processing a substrate; a factory interface (FI) coupled to the processing chamber via a load lock chamber disposed therebetween; and a cleaning chamber coupled to the FI and configured to rinse and to dry the substrate, wherein the cleaning chamber includes a chamber body defining an interior volume and having a first opening at an interface with the FI for transferring the substrate into and out of the interior volume.

公开(公告)号：US20220310424A1

公开(公告)日：2022-09-29

申请号：US17212862

申请日：2021-03-25

Applicant: Applied Materials, Inc.

Inventor： Manoj A. GAJENDRA ,  Mahadev JOSHI ,  Joseph Antony JONATHAN ,  Jamie S. LEIGHTON

IPC: H01L21/67 ,  H01L21/306 ,  H01L21/02 ,  H01L21/66 ,  H01L21/687 ,  B08B3/02 ,  B08B5/02 ,  B08B13/00 ,  B24B37/34 ,  B24B37/013

Abstract: A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. A spin rinse dry (SRD) station configured to clean and dry the substrates. A metrology station configured to measure parameters of the substrates. A robot configured to move the substrate in to and out of the SRD station. And an effector rinse and dry (EERD) station configured to clean and dry an end effector of the robot.

公开(公告)号：US20250116500A1

公开(公告)日：2025-04-10

申请号：US18378543

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Trishul BYREGOWDA SHIVALINGAIAH ,  Skanda Simha CHANDRASHEKAR ,  Karthik Melinamane PRABHAKAR ,  Mahadev JOSHI ,  Peter F. DEMONTE

IPC: G01B9/02

Abstract: Embodiments of interferometric endpoint (IEP) housing assemblies for endpoint detection of plasma processing are provided herein. In some embodiments, IEP housing assemblies include: an IEP housing having an upper end configured to interface with a light source and having an internal cavity, wherein a lower end of the IEP housing is configured to interface with a dome assembly of a process chamber; a bracket having a body disposed about the IEP housing and having a plurality of arms extending radially outward from the body; and a plurality of biasing members extending from the body to the IEP housing and configured to hold the IEP housing within the body while allowing side-to-side deflection.