公开(公告)号：US20180053670A1

公开(公告)日：2018-02-22

申请号：US15637930

申请日：2017-06-29

Applicant: Applied Materials, Inc.

Inventor： Shinichi OKI ,  Yoshinobu MORI ,  Yuji AOKI

IPC: H01L21/67 ,  C23C16/48 ,  H01L21/20

CPC classification number: H01L21/67248 ,  C23C16/4401 ,  C23C16/4405 ,  C23C16/4411 ,  C23C16/455 ,  C23C16/466 ,  C23C16/481 ,  C23C16/52 ,  C30B25/14 ,  H01L21/20

Abstract: An epitaxial deposition chamber having an upper cone for controlling air flow above a dome in the chamber, such as a high growth rate epitaxy chamber, is described herein. The upper cone has first and second components separated by two or more gaps in the chamber, each component having a partial cylindrical region having a first concave inner surface, a first convex outer surface, and a fixed radius of curvature of the first concave inner surface, and a partial conical region extending from the partial cylindrical region, the partial conical region having a second concave inner surface, a second convex outer surface, and a varying radius of curvature of the second concave inner surface, wherein the second concave inner surface extends from the partial cylindrical region to a second radius of curvature less than the fixed radius of curvature.

公开(公告)号：US20160204005A1

公开(公告)日：2016-07-14

申请号：US14973079

申请日：2015-12-17

Applicant: Applied Materials, Inc.

Inventor： Shinichi OKI ,  Yuji AOKI ,  Peter DEMONTE ,  Yoshinobu MORI

IPC: H01L21/67 ,  C23C16/458 ,  C23C16/455

Abstract: A processing chamber for processing a substrate is disclosed herein. In one embodiment, the processing chamber includes a support shaft assembly. The support shaft assembly has a ring shaped susceptor, a disc shaped heat plate, and a support shaft system. The support shaft system supports the susceptor and the heat plate, such that the susceptor is supported above the heat plate defining a gap between the heat plate and the susceptor. In another embodiment, the heat plate includes a plurality of grooves and the susceptor includes a plurality of fins. The fins are configured to sit within the grooves such that the susceptor is supported above the heat plate, defining a gap between the heat plate and the susceptor. In another embodiment, a method of processing a substrate in the aforementioned embodiments is disclosed herein.

Abstract translation: 本文公开了一种用于处理衬底的处理室。 在一个实施例中，处理室包括支撑轴组件。 支撑轴组件具有环形基座，盘形加热板和支撑轴系统。 支撑轴系支撑基座和加热板，使得基座支撑在加热板上方，限定加热板和基座之间的间隙。 在另一个实施例中，加热板包括多个槽，并且基座包括多个翅片。 翅片构造成位于凹槽内，使得基座支撑在加热板上方，从而限定加热板和基座之间的间隙。 在另一个实施例中，本文公开了上述实施例中的衬底的处理方法。

公开(公告)号：US20240120229A1

公开(公告)日：2024-04-11

申请号：US17962410

申请日：2022-10-07

Applicant: Applied Materials, Inc.

Inventor： Shinichi OKI ,  Yuji AOKI ,  Trishul BYREGOWDA SHIVALINGAIAH

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: Embodiments of bipolar electrostatic chucks are provided herein. In some embodiments, a bipolar electrostatic chuck includes a ceramic plate; a plurality of electrodes disposed in the ceramic plate, wherein the plurality of electrodes include one or more positive electrodes arranged in a first pattern and one or more negative electrodes arranged in a second pattern; an aluminum base plate coupled to the ceramic plate; a positive conduit extending through the aluminum base plate and electrically coupled to the one or more positive electrodes, and a negative conduit extending through the aluminum base plate and electrically coupled to the one or more negative electrodes; and a first insulative tube disposed about each of the positive conduit and the negative conduit.

公开(公告)号：US20200020556A1

公开(公告)日：2020-01-16

申请号：US16584208

申请日：2019-09-26

Applicant: Applied Materials, Inc.

Inventor： Shinichi OKI ,  Yoshinobu MORI ,  Yuji AOKI

IPC: H01L21/67 ,  C23C16/44 ,  C23C16/46 ,  C30B25/14 ,  C23C16/48 ,  H01L21/20

Abstract: An epitaxial deposition chamber having an upper cone for controlling air flow above a dome in the chamber, such as a high growth rate epitaxy chamber, is described herein. The upper cone has first and second components separated by two or more gaps in the chamber, each component having a partial cylindrical region having a first concave inner surface, a first convex outer surface, and a fixed radius of curvature of the first concave inner surface, and a partial conical region extending from the partial cylindrical region, the partial conical region having a second concave inner surface, a second convex outer surface, and a varying radius of curvature of the second concave inner surface, wherein the second concave inner surface extends from the partial cylindrical region to a second radius of curvature less than the fixed radius of curvature.

公开(公告)号：US20250051910A1

公开(公告)日：2025-02-13

申请号：US18366433

申请日：2023-08-07

Applicant: Applied Materials, Inc.

Inventor： Shinichi OKI ,  Yoshinobu MORI ,  Yuji AOKI

IPC: C23C16/44 ,  C23C16/458 ,  C23C16/46 ,  C30B25/10 ,  C30B25/12 ,  H01L21/687

Abstract: A pre-heat ring and a process chamber having the same are described herein. In one example, a process chamber for film deposition comprises a chamber volume, a substrate support disposed in the chamber volume, the substrate support having a radially outward surface, and a pre-heat ring surrounding the substrate support. The pre-heat ring comprises a tapered wall facing the radially outward surface. The tapered wall narrows towards a top surface of the pre-heat ring and towards the substrate support.

公开(公告)号：US20190062909A1

公开(公告)日：2019-02-28

申请号：US16031691

申请日：2018-07-10

Applicant: Applied Materials, Inc.

Inventor： Shinichi OKI ,  Yuji AOKI ,  Yoshinobu MORI

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/44

Abstract: In one embodiment, a gas introduction insert includes a gas distribution assembly having a body, a plurality of gas injection channels formed within the gas distribution assembly, at least a portion of the plurality of gas injection channels being adjacent to a blind channel formed in the gas distribution assembly, and a rectification plate bounding one side of the plurality of gas injection channels and the blind channel, the rectification plate including a non-perforated portion corresponding to the position of the blind channel.

公开(公告)号：US20160348275A1

公开(公告)日：2016-12-01

申请号：US15164610

申请日：2016-05-25

Applicant: Applied Materials, Inc.

Inventor： Shinichi OKI ,  Yuji AOKI ,  Yoshinobu MORI

IPC: C30B25/10 ,  C30B25/12 ,  F16L59/02 ,  C30B25/14

CPC classification number: C30B25/10 ,  C23C16/4585 ,  C30B25/12

Abstract: A heat shield assembly for an epitaxy chamber is described herein. The heat shield assembly has a heat shield member and a preheat member. The heat shield member is disposed on the preheat member. The heat shield member has a cutout portion that exposes a portion of the preheat member. The preheat member has a recessed portion to receive the heat shield member.

Abstract translation: 本文描述了用于外延室的隔热组件。 隔热组件具有隔热构件和预热构件。 隔热构件设置在预热构件上。 隔热构件具有暴露预热构件的一部分的切口部分。 预热构件具有用于接纳隔热构件的凹部。