公开(公告)号：US20140273520A1

公开(公告)日：2014-09-18

申请号：US14182970

申请日：2014-02-18

Applicant: Applied Materials, Inc.

Inventor： Robert CHEBI ,  Alfredo GRANADOS ,  Zhao H. CENG ,  Jianqi WANG ,  Rajan BALESAN

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/02118 ,  H01J37/321 ,  H01J37/32119 ,  H01J37/32522 ,  H01L21/67109

Abstract: Embodiments described herein generally relate to an apparatus and methods for reducing the deposition of polymers in a semiconductor processing chamber. A heater jacket and heat sources are provided and may be configured to maintain a uniform temperature profile of the processing chamber. A method of maintaining a uniform temperature profile of a dielectric ceiling of the processing chamber is also provided.

Abstract translation: 本文描述的实施例通常涉及用于减少聚合物在半导体处理室中的沉积的装置和方法。 提供加热器护套和热源，并且可以构造为保持处理室的均匀的温度分布。 还提供了一种维持处理室的电介质天花板的均匀温度分布的方法。