Multi-perspective examination of a specimen

    公开(公告)号:US11035803B1

    公开(公告)日:2021-06-15

    申请号:US16802480

    申请日:2020-02-26

    Abstract: There is provided a system and a method comprising obtaining data representative of potential defects in at least one image of a semiconductor specimen, for each potential defect of at least a first subset of potential defects of the semiconductor specimen, obtaining pixel values representative of the potential defect in multiple images of the specimen which differ from each other by at least one parameter, classifying the potential defects into a plurality of first clusters, for each first cluster, building, based on pixel values representative of potential defects, at least one first matching filter for the first cluster, for at least a given potential defect not belonging to the first subset, determining whether it corresponds to a defect based on the first matching filters associated with the plurality of first clusters.

    Die-to-multi-die wafer inspection

    公开(公告)号:US11803961B2

    公开(公告)日:2023-10-31

    申请号:US17495493

    申请日:2021-10-06

    CPC classification number: G06T7/001 G01N21/9501 G01N21/95607 G06T2207/30148

    Abstract: Disclosed herein is s computer-based method for obtaining and analyzing multi-die scan data of a patterned wafer. The method includes sequentially implementing an operation of scanning a respective plurality of sets of slices on a wafer, and, per each slice segment in a multiplicity of slice segments in the plurality of sets of slices, an operation of performing die-to-multi-die (D2MD) analysis of scan data of the slice segment in order to detect defects in the slice segment. Each set of slices may constitute a subset of the totality of slices on the respective die-column. Sets scanned in a same implementation are analogous to one another, thereby facilitating—in the die-to-multi-die analysis of scan data of a slice segment—taking into account, as reference, scan data of areas on other die-columns, which were scanned in the same implementation.

    Methods and systems for expediting multi-perspective wafer analysis

    公开(公告)号:US11250560B2

    公开(公告)日:2022-02-15

    申请号:US16923882

    申请日:2020-07-08

    Abstract: Disclosed herein is method for multi-perspective-based wafer analysis. The method includes (i) scanning a plurality of pages, or portions thereof, one after the other, wherein each page, or a portion thereof, is successively scanned, in each of a multiplicity of perspectives, and (ii) analyzing scan data of a last scanned page while scanning a next page from the plurality of pages. At least some of the pages include multiple slices of the wafer. The analysis of the scan data includes identifying defects in the scanned pages, based on an integrated analysis combining scan data from each of the multiplicity of perspectives. Further disclosed is a computerized system configured to implement the method.

    Method and system for inspecting an object with an array of beams

    公开(公告)号:US09784689B2

    公开(公告)日:2017-10-10

    申请号:US14797040

    申请日:2015-07-10

    CPC classification number: G01N21/8806 G01N21/9501 G01N2201/0638

    Abstract: According to an embodiment of the invention there may be provided a system for inspecting an object, the system may include a traveling lens acousto-optic device that is configured to generate a sequence of traveling lenses that propagate through an active region of the traveling lens acousto-optic device; an illumination unit that that is configured to illuminate the sequence of traveling lenses to provide a sequence of input beams; a first beam splitter that is configured to split the sequence of input beams to an intermediate array of intermediate beams, the intermediate array comprises multiple sequences of intermediate beams, the sequences of intermediate beams are spaced apart from each other; a masking unit that is configured to mask first beams of the intermediate array and unmask output beams of the intermediate array in an alternating manner; multiple detectors; and an objective lens that is configured to receive the output beams, direct the output beams towards multiple areas of the object, receive collected beams from the multiple areas of the object, and direct the collected beams towards the multiple detectors; and wherein each detector is associated with an area of the multiple areas.

    METHOD FOR INSPECTING AN OBJECT WITH AN ARRAY OF BEAMS
    5.
    发明申请
    METHOD FOR INSPECTING AN OBJECT WITH AN ARRAY OF BEAMS 有权
    用于检查对象的方法用于组织框架

    公开(公告)号:US20170010219A1

    公开(公告)日:2017-01-12

    申请号:US14797040

    申请日:2015-07-10

    CPC classification number: G01N21/8806 G01N21/9501 G01N2201/0638

    Abstract: According to an embodiment of the invention there may be provided a system for inspecting an object, the system may include a traveling lens acousto-optic device that is configured to generate a sequence of traveling lenses that propagate through an active region of the traveling lens acousto-optic device; an illumination unit that that is configured to illuminate the sequence of traveling lenses to provide a sequence of input beams; a first beam splitter that is configured to split the sequence of input beams to an intermediate array of intermediate beams, the intermediate array comprises multiple sequences of intermediate beams, the sequences of intermediate beams are spaced apart from each other; a masking unit that is configured to mask first beams of the intermediate array and unmask output beams of the intermediate array in an alternating manner; multiple detectors; and an objective lens that is configured to receive the output beams, direct the output beams towards multiple areas of the object, receive collected beams from the multiple areas of the object, and direct the collected beams towards the multiple detectors; and wherein each detector is associated with an area of the multiple areas.

    Abstract translation: 根据本发明的实施例,可以提供一种用于检查物体的系统,该系统可以包括行进透镜声光装置,其被配置为产生传播通过移动透镜声音的有源区域的行进透镜序列 光设备 照明单元,被配置为照亮所述行进透镜的顺序以提供输入光束的序列; 第一分束器,其被配置为将输入光束序列分割成中间光束的中间阵列,所述中间阵列包括多个中间光束序列,所述中间光束的序列彼此间隔开; 掩模单元,被配置为屏蔽所述中间阵列的第一光束,并且以交替方式解除所述中间阵列的输出光束的屏蔽; 多个探测器; 以及物镜,被配置为接收输出光束,将输出光束导向物体的多个区域,从物体的多个区域接收收集的光束,并将收集的光束引向多个检测器; 并且其中每个检测器与所述多个区域的区域相关联。

    Methods and systems for analysis of wafer scan data

    公开(公告)号:US11688055B2

    公开(公告)日:2023-06-27

    申请号:US17160364

    申请日:2021-01-27

    Abstract: Disclosed is a computerized method for detecting defects on a sample. The method includes: (i) receiving scan data corresponding to a pixel on the sample; (ii) computing a difference vector d based on the scan data and corresponding reference data; (iii) computing a parameter D dependent on t=Γd−(Glinear/∥Γs∥2)Γs, wherein ΓTΓ=K−1 with K being a covariance matrix corresponding to the pixel, s is a predetermined kernel characterizing a defect signal, and Glinear=s·(K−1 d) is a gaussian approximation of a likelihood ratio test expression for distinguishing the defect signal from noise, and wherein D substantially monotonically increases with ∥t∥; and (iv) computing a score q(g, D) indicative of whether the pixel is defective, wherein g is a parameter indicative of a value of Glinear and q(g, D) substantially monotonically increases with g and substantially monotonically decreases with D.

    Three-dimensional surface metrology of wafers

    公开(公告)号:US11662324B1

    公开(公告)日:2023-05-30

    申请号:US17698393

    申请日:2022-03-18

    Abstract: A computer-based method for three-dimensional surface metrology of samples based on scanning electron microscopy and atomic force microscopy. The method includes: (i) using a scanning electron microscope (SEM) to obtain SEM data of a set of sites on a surface of a sample; (ii) using an atomic force microscope (AFM) to measure vertical parameters of sites in a calibration subset of the set; (iii) calibrating an algorithm, configured to estimate a vertical parameter of a site when SEM data of the site are fed as inputs, by determining free parameters of the algorithm, such that residuals between the algorithm-estimated vertical parameters and the AFM-measured vertical parameters are about minimized; and (iv) using the calibrated algorithm to estimate vertical parameters of the sites in the complement to the calibration subset.

    METHODS AND SYSTEMS FOR EXPEDITING MULTI-PERSPECTIVE WAFER ANALYSIS

    公开(公告)号:US20220012862A1

    公开(公告)日:2022-01-13

    申请号:US16923882

    申请日:2020-07-08

    Abstract: Disclosed herein is method for multi-perspective-based wafer analysis. The method includes (i) scanning a plurality of pages, or portions thereof, one after the other, wherein each page, or a portion thereof, is successively scanned, in each of a multiplicity of perspectives, and (ii) analyzing scan data of a last scanned page while scanning a next page from the plurality of pages. At least some of the pages include multiple slices of the wafer. The analysis of the scan data includes identifying defects in the scanned pages, based on an integrated analysis combining scan data from each of the multiplicity of perspectives. Further disclosed is a computerized system configured to implement the method.

    Computerized system and method for obtaining information about a region of an object

    公开(公告)号:US10902582B2

    公开(公告)日:2021-01-26

    申请号:US16250980

    申请日:2019-01-17

    Abstract: A method, system and computer readable medium for providing information about a region of a sample. The method includes (i) obtaining, by an imager, multiple images of the region; wherein the multiple images differ from each other by at least one parameter (ii) receiving or generating multiple reference images; (iii) generating multiple difference images that represent differences between the multiple images and the multiple reference images; (iv) calculating a set of region pixel attributes, (v) calculating a set of noise attributes, based on multiple sets of region pixels attributes of the multiple region pixels; and (vi) determining for each region pixel, whether the region pixel represents a defect based on a relationship between the set of noise attributes and the set of region pixel attributes of the pixel.

    Systems and methods for inspecting an object
    10.
    发明授权
    Systems and methods for inspecting an object 有权
    用于检查物体的系统和方法

    公开(公告)号:US09535014B1

    公开(公告)日:2017-01-03

    申请号:US14800625

    申请日:2015-07-15

    Abstract: A system, including an illumination module that comprises (a) a first traveling lens acousto-optic device; (b) a light source for illuminating the first traveling lens to provide an input beam that propagates along a first direction; (c) illumination optics for outputting an output beam that scans the object at a second direction; a detection unit; and a collection module for collecting a collected beam from the object, wherein the collected beam propagates along a third direction; and optically manipulating the collected beam to provide a counter-scan beam is directed towards the detection unit and has a focal point that is positioned at a same location regardless of the propagation of the collected beam along the third direction.

    Abstract translation: 一种系统,包括照明模块,该照明模块包括:(a)第一行进透镜声光装置; (b)用于照亮第一移动透镜以提供沿着第一方向传播的输入光束的光源; (c)用于输出在第二方向扫描物体的输出光束的照明光学器件; 检测单元; 以及收集模块,用于从所述物体收集收集的光束,其中所述收集的光束沿着第三方向传播; 并且将所收集的光束光学操纵以提供反向扫描光束指向检测单元,并且具有位于相同位置的焦点,而不管收集的光束沿着第三方向的传播。

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