公开(公告)号：US11995848B2

公开(公告)日：2024-05-28

申请号：US17209086

申请日：2021-03-22

Applicant: Applied Materials Israel Ltd.

Inventor： David Uliel ,  Yan Avniel ,  Bobin Mathew Skaria ,  Oz Fox-Kahana ,  Gal Daniel Gutterman ,  Atai Baldinger ,  Murad Muslimany ,  Erez Lidor

IPC: G06K9/00 ,  G06F18/22 ,  G06T5/50 ,  G06T7/00 ,  G06T7/30 ,  H01J37/26

CPC classification number: G06T7/30 ,  G06F18/22 ,  G06T5/50 ,  G06T7/001 ,  H01J37/261 ,  G06T2207/20221 ,  G06T2207/30148 ,  H01J2237/221

Abstract: There is provided a system and method of examination of a semiconductor specimen, comprising: obtaining a sequence of frames of an area of the specimen acquired by an electron beam tool configured to scan the area from a plurality of directions, the sequence comprising a plurality of sets of frames each acquired from a respective direction; and registering the plurality of sets of frames and generating an image of the specimen based on result of the registration, comprising: performing, for each direction, a first registration among the set of frames acquired therefrom, and combining the registered set of frames to generate a first composite frame, giving rise to a plurality of first composite frames respectively corresponding to the plurality of directions; and performing a second registration among the plurality of first composite frames, and combining the registered plurality of first composite frames to generate the image of the specimen.

公开(公告)号：US20240386589A1

公开(公告)日：2024-11-21

申请号：US18198768

申请日：2023-05-17

Applicant: Applied Materials Israel Ltd.

Inventor： Mor Baram ,  Gadi Oron ,  Shmuel Mizrachi ,  David Uliel ,  Ifat Neuberger ,  Eyal Angel

IPC: G06T7/55 ,  G06T3/60 ,  G06T7/12 ,  G06T7/60 ,  H01J37/244 ,  H01J37/26

Abstract: An electron beam spot shape reconstruction unit that includes a processing circuit and a memory unit. The processing circuit is configured to reconstruct a shape of an electron beam spot by (i) obtaining multiple groups of images of circular targets of a sample, wherein different groups of images of the multiple groups of images are associated with different polar angles; (ii) processing at least two of the multiple groups of images to determine first-axis edge width information and second-axis edge width information; and (iii) reconstructing the electron beam spot shape based on the first-axis edge width information and second-axis edge width information.