公开(公告)号：US20150054962A1

公开(公告)日：2015-02-26

申请号：US14461122

申请日：2014-08-15

申请人： Aptina Imaging Corporation

发明人： Swarnal Borthakur ,  Ulrich Boettiger ,  Sergey Velichko

IPC分类号： H04N5/33 ,  H04N5/374 ,  H04N9/04

CPC分类号： H04N5/332 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/369 ,  H01L2924/00014 ,  H01L2924/00

摘要： An imaging system may include a first image sensor die stacked on top of a second image sensor die. A pixel array may include first pixels having photodiodes in the first image sensor die and second pixels having photodiodes in the second image sensor die. The first pixels may be optimized to detect a first type of electromagnetic radiation (e.g., visible light), whereas the second pixels may be optimized to detect a second type of electromagnetic radiation (e.g., infrared light). Light guide channels may be formed in the first image sensor die to help guide incident light to the photodiodes in the second image sensor substrate. The first and second image sensor dies may be bonded at a wafer level. A first image sensor wafer may be a backside illumination image sensor wafer and a second image sensor wafer may be a front or backside illumination image sensor wafer.

摘要翻译： 成像系统可以包括堆叠在第二图像传感器芯片的顶部上的第一图像传感器管芯。 像素阵列可以包括在第一图像传感器管芯中具有光电二极管的第一像素和在第二图像传感器管芯中具有光电二极管的第二像素。 可以优化第一像素以检测第一类型的电磁辐射（例如可见光），而可以优化第二像素以检测第二类型的电磁辐射（例如，红外光）。 可以在第一图像传感器管芯中形成导光通道，以帮助将入射光引导到第二图像传感器基板中的光电二极管。 第一和第二图像传感器管芯可以在晶片级结合。 第一图像传感器晶片可以是背面照明图像传感器晶片，并且第二图像传感器晶片可以是前侧或后侧照明图像传感器晶片。

公开(公告)号：US20140055654A1

公开(公告)日：2014-02-27

申请号：US13972249

申请日：2013-08-21

申请人： Aptina Imaging Corporation

发明人： Swarnal Borthakur ,  Scott Churchwell ,  Ulrich Boettiger ,  Marc Sulfridge ,  Andrew Perkins ,  Rick Lake

IPC分类号： H04N5/335

CPC分类号： H04N5/335 ,  H01L27/14612 ,  H01L27/14616 ,  H01L27/14641 ,  H01L2224/16225 ,  H01L2224/73267 ,  H04N5/2253 ,  H04N5/2254

摘要： An image sensor unit may have a backside-illuminated imager and an image co-processor stacked together. The image co-processor may be mounted in a cavity in a permanent carrier. The permanent carrier may include fluid channels that allow cooling fluid to flow past the image co-process and past the imager, thereby removing excess heat generated by the image sensor unit during operation.

摘要翻译： 图像传感器单元可以具有背面照射的成像器和图像协处理器堆叠在一起。 图像协处理器可以安装在永久载体中的空腔中。 永久性载体可以包括允许冷却流体流过图像协同处理并经过成像器的流体通道，从而在操作期间消除由图像传感器单元产生的多余的热量。

公开(公告)号：US09699393B2

公开(公告)日：2017-07-04

申请号：US14316648

申请日：2014-06-26

申请人： Aptina Imaging Corporation

发明人： Ulrich Boettiger ,  Richard Scott Johnson

IPC分类号： H04N5/33 ,  H01L31/0232 ,  H01L27/146

CPC分类号： H04N5/332 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14643 ,  H01L31/02327

摘要： An image sensor may include a pixel array having visible and infrared imaging pixels for simultaneously detecting light in the visible and infrared spectral ranges. The pixel array may include an array of photodiodes, an array of filter elements formed over the photodiodes, and an array of microlenses formed over the array of filter elements. The filter elements may include infrared cutoff filter elements that block infrared light while passing visible light. The infrared cutoff filter elements may be formed from a patterned layer of infrared blocking material. Each visible imaging pixel includes a portion of the infrared blocking material and a color filter element. Each infrared imaging pixel is aligned with an opening in the infrared blocking material. The opening may be filled with an infrared pass filter element that passes infrared light while blocking visible light.

公开(公告)号：US20150137297A1

公开(公告)日：2015-05-21

申请号：US14086336

申请日：2013-11-21

申请人： Aptina Imaging Corporation

发明人： Ulrich Boettiger ,  Swarnal Borthakur ,  Andrew Perkins

IPC分类号： H01L27/146 ,  H01L31/18

CPC分类号： H01L27/14685 ,  H01L27/14621

摘要： An array of color filter elements may be formed over an array of photodiodes in an integrated circuit for an imaging device using a carrier substrate. The carrier substrate may have a planar surface with a release layer. A layer of color filter material may be applied to the release layer. The carrier substrate may then be flipped and the layer of color filter material may be bonded to the integrated circuit. Heat may be applied to activate the release layer and the carrier substrate may be removed at the interface between the release layer and the color filter material. The layer of color filter material may be patterned either before bonding the layer of color filter material or after the carrier substrate is removed. A layer of microlenses may be formed over the array of color filter elements using a carrier substrate.

摘要翻译： 可以在用于使用载体衬底的成像装置的集成电路中的光电二极管阵列上形成滤色器元件阵列。 载体基底可以具有带有释放层的平坦表面。 可以将一层滤色器材料施加到释放层。 然后可以将载体衬底翻转，并且滤色器材料层可以结合到集成电路。 可以施加热量以激活释放层，并且可以在剥离层和滤色器材料之间的界面处去除载体衬底。 彩色滤光片材料层可以在结合滤色器材料层之前或在移除载体衬底之后进行图案化。 可以使用载体衬底在彩色滤光器阵列的阵列上形成微透镜层。