System and method for carrying out liquid and subsequent drying treatments on one or more wafers
    1.
    发明申请
    System and method for carrying out liquid and subsequent drying treatments on one or more wafers 有权
    用于在一个或多个晶片上进行液体和随后的干燥处理的系统和方法

    公开(公告)号:US20070042110A9

    公开(公告)日:2007-02-22

    申请号:US10866916

    申请日:2004-06-14

    IPC分类号: B05D5/12 B05C5/00

    摘要: Systems for processing microelectronic substrates in a process chamber that incorporate improved technology for transitioning from a wet process to a dry process (especially transitioning from rinsing to drying). At least a portion of residual liquid remaining in fluid supply lines after a wet treatment is removed via a pathway that avoids purging directly onto the substrates. Related methods are also included in the present invention.

    摘要翻译: 用于在处理室中处理微电子衬底的系统,其包含用于从湿法转变为干法(特别是从漂洗到干燥的过渡)的改进技术。 在湿处理之后残留在流体供应管线中的剩余液体的至少一部分通过避免直接吹扫到基底上的通道去除。 相关方法也包括在本发明中。