公开(公告)号：US06257480B1

公开(公告)日：2001-07-10

申请号：US09340716

申请日：1999-06-29

申请人： Atushi Furumoto ,  Ataru Ichikawa ,  Tatsuya Kubo ,  Misao Tanaka ,  Mitsuhiro Sugiura ,  Kenji Arai

发明人： Atushi Furumoto ,  Ataru Ichikawa ,  Tatsuya Kubo ,  Misao Tanaka ,  Mitsuhiro Sugiura ,  Kenji Arai

IPC分类号： B23K3100

CPC分类号： B23K3/0653 ,  B23K1/085 ,  B23K3/08 ,  B23K3/082 ,  H05K3/3468

摘要： In a jet soldering method, a substrate is held by an actuator and pre-heated by a pre-heater. The pre-heater has a shield member or the substrate is swung to equalize temperature distribution in the substrate. The substrate is then transferred over a primary jet soldering bath while dipping a treatment surface of the substrate in a primary solder jet, so that solder stick to the treatment surface of the substrate. Then, the substrate is transferred over a secondary jet soldering bath while dipping the treatment surface in a secondary solder jet, so that the solder sticking to the substrate is shaped. The transfer conditions of the substrate are differentiated between transfers over the primary jet soldering bath and the secondary jet soldering bath.

摘要翻译： 在喷射焊接方法中，基板由致动器保持并由预热器预热。 预热器具有屏蔽构件或摆动基板以均衡衬底中的温度分布。 然后将衬底在主喷射焊浴上转移，同时将衬底的处理表面浸入主焊料射流中，使得焊料粘附到衬底的处理表面。 然后，在二次喷射焊接槽中转移基板，同时将处理表面浸入辅助焊料喷射中，使得焊接到基板上的焊料成形。 在一次喷射焊接槽和二次喷射焊接槽之间的转移之间区分衬底的转移条件。

公开(公告)号：US06412682B2

公开(公告)日：2002-07-02

申请号：US09886042

申请日：2001-06-22

申请人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

发明人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

IPC分类号： B23K3112

CPC分类号： B23K1/085 ,  B23K3/0653 ,  H05K3/3468

摘要： In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

摘要翻译： 在工件与波熔融焊料接触的状态下焊接工件的方法中，在将工件浸入波熔融焊料中的浸入深度保持恒定的同时进行焊接工艺。 通过根据工件在其高度方向上的位移量来改变工件的高度位置和波熔融焊料的波高之一来进行浸入深度控制。 因此，即使当工件发生热翘曲时，也可以以高质量执行焊接工艺。

公开(公告)号：US06273319B1

公开(公告)日：2001-08-14

申请号：US09229444

申请日：1999-01-13

申请人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

发明人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

IPC分类号： B23K3112

CPC分类号： B23K1/085 ,  B23K3/0653 ,  H05K3/3468

摘要： In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

公开(公告)号：US06273317B1

公开(公告)日：2001-08-14

申请号：US09420579

申请日：1999-10-19

申请人： Kenji Arai ,  Ataru Ichikawa ,  Atsushi Furumoto ,  Tatuya Kubo ,  Misao Tanaka ,  Mitsuhiro Sugiura

发明人： Kenji Arai ,  Ataru Ichikawa ,  Atsushi Furumoto ,  Tatuya Kubo ,  Misao Tanaka ,  Mitsuhiro Sugiura

IPC分类号： B23K1600

CPC分类号： B23K1/085 ,  B23K3/0653 ,  B23K3/087

摘要： In a flow soldering apparatus, a substrate is clamped by a pair of nails of a chuck mechanism and transferred over a molten solder barrel while being held in contact with a molten solder. The nails are held resiliently to each other, so that the substrate is allowed to expand thermally between the nails without bowing. The chuck mechanism has a scraper nail which extends transversely over the entire lateral length of the substrate at the front side of the substrate in a substrate transfer direction to push away an oxide film formed on the molten solder. The chuck mechanism is constructed to allow the molten solder to enter underneath the substrate in the lateral direction with respect to the substrate transfer direction. After completing one soldering operation, the nails change the set of the opposing two sides to another set of two opposing sides of the substrate, so that the substrate is subjected to the soldering operation from a direction different from the preceding soldering operation.

摘要翻译： 在流动焊接装置中，通过卡盘机构的一对钉子夹持基板，并在与熔融焊料保持接触的同时在熔融焊料滚筒上转移。 钉子彼此弹性地保持，使得允许基底在指甲之间热不断地膨胀而不弯曲。 卡盘机构具有在基板传送方向上在基板的前侧横向延伸到基板的整个横向长度的刮刀，以推动形成在熔融焊料上的氧化膜。 卡盘机构构造成允许熔融焊料相对于基板传送方向在横向方向上进入基板的下方。 在完成一次焊接操作之后，指甲将相对的两侧的一组改变成另一组两个相对的基板，使得基板从与前面的焊接操作不同的方向进行焊接操作。

公开(公告)号：US20100142873A1

公开(公告)日：2010-06-10

申请号：US12618069

申请日：2009-11-13

申请人： Mitsuhiro Sugiura

发明人： Mitsuhiro Sugiura

IPC分类号： F16C33/76

CPC分类号： F16C33/7856 ,  F16C19/06 ,  F16C33/7823 ,  F16C2240/70 ,  F16J15/3456

摘要： When a sealed rolling bearing is subjected to temperature increase caused by the friction heat of the seal and external heat and is subsequently cooled down, negative pressure is created in an internal space of the bearing and causes a seal lip of the bearing to stick to a seal groove, resulting in abrasion of the seal lip. The present invention solves the problem while maintaining sealing performance of the seal lip. In a sealed rolling bearing in which a sealing member has a seal lip on its edge and the seal lip abuts against a raceway-side groove wall of a seal groove adjacent to an inner raceway, the seal lip has a contact tip shaped into an arc whose radius of curvature R ranges from 0.1 mm to less than 0.2 mm.

摘要翻译： 当密封的滚动轴承受到由密封件的摩擦热和外部热量引起的温度升高并且随后冷却时，在轴承的内部空间中产生负压，并使轴承的密封唇粘附到 密封槽，导致密封唇的磨损。 本发明在保持密封唇的密封性能的同时解决了这个问题。 在其密封件在其边缘上具有密封唇缘并且密封唇抵靠邻近内滚道的密封槽的滚道侧槽壁的密封滚动轴承中，密封唇具有形成为弧形的接触尖端 其曲率半径R从0.1mm到小于0.2mm。