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公开(公告)号：US08957505B2
公开(公告)日：2015-02-17
申请号：US13781778
申请日：2013-03-01
Applicant: Au Optronics Corporation
Inventor： Cheng-Liang Wang , Shih-Hsing Hung , Keh-Long Hwu
CPC classification number: H01L23/562 , H01L21/02107 , H01L21/0217 , H01L21/02274 , H01L21/48 , H01L51/0097 , H01L2224/32145 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , Y02E10/549 , Y02P70/521 , H01L2924/00
Abstract: A fabricating method of a device substrate including the following procedures is provided. First, a substrate is provided and a patterned structure is formed on the substrate, wherein the patterned structure includes a plurality of openings. Then, a protective layer is formed on the patterned structure, wherein the protective layer does not fully fill the openings of the patterned structure such that a gap is existed between the protective layer and the patterned structure. Later, a device layer is formed on the protective layer.
Abstract translation: 提供了包括以下步骤的装置基板的制造方法。 首先，提供基板并且在基板上形成图案化结构，其中图案化结构包括多个开口。 然后，在图案化结构上形成保护层，其中保护层未完全填充图案化结构的开口，使得在保护层和图案化结构之间存在间隙。 之后，在保护层上形成器件层。
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公开(公告)号：US20230064954A1
公开(公告)日：2023-03-02
申请号：US17519557
申请日：2021-11-04
Applicant: Au Optronics Corporation
Inventor： Shiuan-Tzung Cheng , Ching-Yao Shih , Cheng-Liang Wang
Abstract: A display device includes a circuit substrate, a silicon dioxide pattern, and a plurality of light-emitting elements. The silicon dioxide pattern is located on the circuit substrate and has a plurality of openings. The light-emitting elements are located on the circuit substrate and are electrically connected to the circuit substrate. The light-emitting elements are located in the openings and are adjacent to the silicon dioxide pattern. A manufacturing method of a display device is also provided.
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公开(公告)号：US20150311409A1
公开(公告)日：2015-10-29
申请号：US14472359
申请日：2014-08-28
Applicant: Au Optronics Corporation
Inventor： Chen-Shuo Huang , Chia-Hsun Tu , Cheng-Liang Wang , Shih-Hsing Hung , Meng-Ting Lee
CPC classification number: G02F1/1362 , G02F1/1333
Abstract: A display panel and a display mother board including the display panel are provided. The display panel includes a substrate, a pixel array, at least one driver circuit, an insulating layer, and a metal wall. The substrate includes a display region and a non-display region, and the non-display region has a driver circuit region and an outer region disposed outside of the driver circuit region. The pixel array and the driver circuit are disposed in the display region and the driver circuit region respectively. The insulating layer is disposed on the substrate and in the non-display region. The metal wall is disposed on the insulating layer and in the outer region, wherein a Poisson's ratio of the metal wall is greater than or equal to 0.32.
Abstract translation: 提供了包括显示面板的显示面板和显示母板。 显示面板包括基板，像素阵列，至少一个驱动电路，绝缘层和金属壁。 基板包括显示区域和非显示区域，非显示区域具有设置在驱动电路区域外的驱动电路区域和外部区域。 像素阵列和驱动电路分别设置在显示区域和驱动器电路区域中。 绝缘层设置在基板上和非显示区域中。 金属壁设置在绝缘层上和外部区域中，其中金属壁的泊松比大于或等于0.32。
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公开(公告)号：US20140077340A1
公开(公告)日：2014-03-20
申请号：US13781778
申请日：2013-03-01
Applicant: AU OPTRONICS CORPORATION
Inventor： Cheng-Liang Wang , Shih-Hsing Hung , Keh-Long Hwu
CPC classification number: H01L23/562 , H01L21/02107 , H01L21/0217 , H01L21/02274 , H01L21/48 , H01L51/0097 , H01L2224/32145 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , Y02E10/549 , Y02P70/521 , H01L2924/00
Abstract: A fabricating method of a device substrate including the following procedures is provided. First, a substrate is provided and a patterned structure is formed on the substrate, wherein the patterned structure includes a plurality of openings. Then, a protective layer is formed on the patterned structure, wherein the protective layer does not fully fill the openings of the patterned structure such that a gap is existed between the protective layer and the patterned structure. Later, a device layer is formed on the protective layer.
Abstract translation: 提供了包括以下步骤的装置基板的制造方法。 首先，提供基板并且在基板上形成图案化结构，其中图案化结构包括多个开口。 然后，在图案化结构上形成保护层，其中保护层不完全填充图案化结构的开口，使得在保护层和图案化结构之间存在间隙。 之后，在保护层上形成器件层。
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