公开(公告)号：US20200369046A1

公开(公告)日：2020-11-26

申请号：US16989165

申请日：2020-08-10

申请人： Aya YAMASAWA ,  Manabu Arita ,  Toshihito KAMEI ,  Shinichi Hatanaka

发明人： Aya YAMASAWA ,  Manabu Arita ,  Toshihito KAMEI ,  Shinichi Hatanaka

IPC分类号： B41J11/00 ,  B29C64/112 ,  B29C64/393 ,  B41J2/01 ,  G01B11/30

摘要： A liquid discharge apparatus includes a liquid discharge device, circuitry, and a curing device. The liquid discharge device is configured to discharge a liquid having a curing degree variable by a stimulation amount while relatively moving to a recording medium. The circuitry is configured to acquire surface roughness information indicating glossiness of a formed object formed on the recording medium and set a stimulation amount for the liquid based on the surface roughness information. The curing device is configured to stimulate the liquid discharged by the liquid discharge device based on the stimulation amount set by the circuitry to cure the liquid. The circuitry is configured to set, based on the surface roughness information, the stimulation amount for each region stimulated by the curing device in a same plane of the formed object.

公开(公告)号：US20190299659A1

公开(公告)日：2019-10-03

申请号：US16358165

申请日：2019-03-19

申请人： Aya YAMASAWA ,  Manabu ARITA ,  Toshihito KAMEI ,  Shinichi HATANAKA

发明人： Aya YAMASAWA ,  Manabu ARITA ,  Toshihito KAMEI ,  Shinichi HATANAKA

IPC分类号： B41J11/00 ,  B41J2/01 ,  B29C64/112 ,  B29C64/393 ,  G01B11/30

摘要： A liquid discharge apparatus includes a liquid discharge device, circuitry, and a curing device. The liquid discharge device is configured to discharge a liquid having a curing degree variable by a stimulation amount while relatively moving to a recording medium. The circuitry is configured to acquire surface roughness information indicating glossiness of a formed object formed on the recording medium and set a stimulation amount for the liquid based on the surface roughness information. The curing device is configured to stimulate the liquid discharged by the liquid discharge device based on the stimulation amount set by the circuitry to cure the liquid. The circuitry is configured to set, based on the surface roughness information, the stimulation amount for each region stimulated by the curing device in a same plane of the formed object.