公开(公告)号：US20230163041A1

公开(公告)日：2023-05-25

申请号：US17534224

申请日：2021-11-23

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Jacob R. Mauermann ,  Alan P. Boone ,  Kaitlyn M. Fisher

IPC: H01L23/367 ,  H01L23/433

CPC classification number: H01L23/3675 ,  H01L23/4334

Abstract: A die level cavity heat sink that can be used within current and emerging packaging technologies to improve die level thermal performance within the package. Alternatively, or in addition, selective heat sink elements are provided to further manage thermal performance within a package by providing thermal pads from the interior of the package to a surface of a mold cap where additional thermal cooling mechanisms can be utilized to further remove heat from the package area.

公开(公告)号：US20230163040A1

公开(公告)日：2023-05-25

申请号：US17533809

申请日：2021-11-23

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Alan P. Boone ,  Kaitlyn M. Fisher ,  Jacob R. Mauermann

IPC: H01L23/367 ,  H01L25/10

CPC classification number: H01L23/3675 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094

Abstract: A die level cavity heat sink that can be used within current and emerging packaging technologies to improve die level thermal performance within the package. Alternatively, or in addition, selective heat sink elements are provided to further manage thermal performance within a package by providing thermal pads from the interior of the package to a surface of a mold cap where additional thermal cooling mechanisms can be utilized to further remove heat from the package area.