公开(公告)号：US09787914B2

公开(公告)日：2017-10-10

申请号：US14845861

申请日：2015-09-04

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Louise C Sengupta ,  Pierre-Alain S Auroux ,  Evan A Binkerd ,  Richard J Blackwell, Jr. ,  Mihir D Boal ,  Jeffrey F Bryant ,  Don A Harris ,  Donald D McManus

IPC: H04N5/33 ,  H01L27/146 ,  H01L27/108 ,  H01L27/11517 ,  H01L27/11563 ,  H04N5/225

CPC classification number: H04N5/33 ,  H01L27/10805 ,  H01L27/11517 ,  H01L27/11563 ,  H01L27/11582 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L28/00 ,  H04N5/2257

Abstract: An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window.