公开(公告)号：US10214663B2

公开(公告)日：2019-02-26

申请号：US15502932

申请日：2015-07-24

Applicant: BASF SE

Inventor： Yongqing Lan ,  Bastian Marten Noller ,  Yuzhuo Li ,  Liang Jiang ,  Daniel Kwo-Hung Shen ,  Reza Golzarian

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/321

Abstract: Described are a chemical-mechanical polishing (CMP) composition comprising abrasive particles in the form of organic/inorganic composite particles as well as the use of said composite particles as abrasive particles in a CMP composition and processes for the manufacture of a semiconductor device comprising chemical mechanical polishing of a substrate in the presence said CMP composition.