LOW-LOSS COPLANAR WAVEGUIDE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240045160A1

    公开(公告)日:2024-02-08

    申请号:US18363984

    申请日:2023-08-02

    CPC classification number: G02B6/4283 G02B6/4279

    Abstract: Disclosed are a low-loss coplanar waveguide bonding structure and a manufacturing method thereof, relating to the technical field of semiconductor. The low-loss coplanar waveguide bonding structure includes: a first coplanar waveguide on a first substrate, a second coplanar waveguide on a second substrate and having a same structure as the first coplanar waveguide, and a plurality of two-dimensional heterostructures connecting conductors of the first coplanar waveguide and the second coplanar waveguide in a one-to-one correspondence, where the two-dimensional heterostructures includes: a two-dimensional conductive material layer for signal transmission and a two-dimensional dielectric material layer under the two-dimensional conductive material layer.

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