公开(公告)号：US12224081B2

公开(公告)日：2025-02-11

申请号：US17790468

申请日：2021-11-23

Applicant: Beijing Dream Ink Technologies Co., Ltd.

Inventor： Zhongwei Ren ,  Jiameng Kang

IPC: H01B1/22 ,  C08K3/08 ,  C08L63/00 ,  C08L75/08 ,  H05K1/09 ,  H05K3/12 ,  H05K3/34

Abstract: The present application provides a conductive paste and an electronic device, and relates to the technical field of function materials. The conductive paste according to the present application includes: a base resin, a solvent, a conductive filler, a curing agent, and an auxiliary agent. The base resin is a mixture of epoxy resin and polyurethane, a weight percentage of the epoxy resin in the base resin is greater than or equal to 50%, and the epoxy resin limits the polyurethane in a structure formed by curing of the base resin. According to the technical solution of the present application, soldering can be performed directly by solder paste, and good flexibility is brought.

公开(公告)号：US12046391B2

公开(公告)日：2024-07-23

申请号：US17776739

申请日：2021-10-20

Applicant: BEIJING DREAM INK TECHNOLOGIES CO., LTD.

Inventor： Zhenlong Men ,  Zhongwei Ren ,  Jiameng Kang

IPC: H01B1/22 ,  B22F1/103

CPC classification number: H01B1/22 ,  B22F1/103 ,  B22F2201/02 ,  B22F2201/11 ,  B22F2201/20

Abstract: A method for prepares low melting point metal particles, a conductive paste and a method for preparing the conductive paste, and relates to the technical field of functional materials. The method for preparing low melting point metal particles includes providing an organic resin carrier having fluidity, adding a low melting point metal material and the organic resin carrier into a sealed container for a vacuuming operation or filling a protective gas, making a temperature in the sealed container higher than the melting point of the low melting point metal and performing dispersion by stirring, and lowering the temperature, after performing the dispersion, to be below the melting point of the low melting point metal with continuous stirring during a cooling process to obtain low melting point metal particles dispersed in the organic resin carrier. Low melting point metal particles can be effectively prepared.

公开(公告)号：US20230170108A1

公开(公告)日：2023-06-01

申请号：US17790468

申请日：2021-11-23

Applicant: Beijing Dream Ink Technologies Co., Ltd.

Inventor： Zhongwei Ren ,  Jiameng Kang

IPC: H01B1/22 ,  H05K1/09 ,  H05K3/12 ,  H05K3/34 ,  C08L63/00 ,  C08L75/08 ,  C08K3/08

CPC classification number: H01B1/22 ,  H05K1/092 ,  H05K3/1283 ,  H05K3/34 ,  C08L63/00 ,  C08L75/08 ,  C08K3/08 ,  H05K2201/032 ,  C08K2003/0806

Abstract: The present application provides a conductive paste and an electronic device, and relates to the technical field of function materials. The conductive paste according to the present application includes: a base resin, a solvent, a conductive filler, a curing agent, and an auxiliary agent. The base resin is a mixture of epoxy resin and polyurethane, a weight percentage of the epoxy resin in the base resin is greater than or equal to 50%, and the epoxy resin limits the polyurethane in a structure formed by curing of the base resin. According to the technical solution of the present application, soldering can be performed directly by solder paste, and good flexibility is brought.