Display Substrate and Preparation Method Thereof, and Display Apparatus

    公开(公告)号:US20220310573A1

    公开(公告)日:2022-09-29

    申请号:US17299798

    申请日:2020-08-31

    IPC分类号: H01L25/16 H01L27/20 G06V40/13

    摘要: Provided is a display substrate, which includes a base substrate, a circuit structure layer disposed on the base substrate, multiple ultrasonic sensing elements and multiple micro light-emitting elements. The multiple ultrasonic sensing elements are disposed on a side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer, and the multiple light-emitting elements are disposed on the side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer. An orthographic projection of the multiple ultrasonic sensing elements on the base substrate does not overlap with an orthographic projection of the multiple micro light-emitting elements on the base substrate.

    ARRAY SUBSTRATE AND ITS MANUFACTURING METHOD
    6.
    发明申请
    ARRAY SUBSTRATE AND ITS MANUFACTURING METHOD 有权
    阵列基板及其制造方法

    公开(公告)号:US20140048826A1

    公开(公告)日:2014-02-20

    申请号:US13967536

    申请日:2013-08-15

    IPC分类号: H01L33/00

    摘要: An array substrate comprises a substrate, a gate electrode, a source electrode and a drain electrode, the source electrode and the drain electrode being provided in different areas on the substrate and the vertical projections of the source electrode and the drain electrode on the substrate having an overlapping area; a semiconductor layer formed between the source electrode and the drain electrode, a vertical projection of the semiconductor layer on the substrate having overlapping areas with the vertical projections of the source electrode and the drain electrode on the substrate; a first insulating layer formed on the substrate while below the gate electrode and covering the source electrode or the drain electrode; a pixel electrode, a gate line, and a data line. A manufacturing method for the array substrate is also disclosed.

    摘要翻译: 阵列基板包括基板,栅电极,源电极和漏电极,源电极和漏电极设置在基板上的不同区域中,并且源电极和漏电极的垂直突起在基板上具有 重叠区域; 形成在源电极和漏电极之间的半导体层,衬底上的半导体层的垂直投影,其具有与源电极和漏电极的垂直突起重叠的区域; 第一绝缘层,形成在所述基板上,同时在所述栅电极下方并覆盖所述源电极或所述漏电极; 像素电极,栅极线和数据线。 还公开了阵列基板的制造方法。

    MASS TRANSFER METHOD AND SYSTEM FOR MICRO LIGHT EMITTING DIODES

    公开(公告)号:US20210407841A1

    公开(公告)日:2021-12-30

    申请号:US16770655

    申请日:2019-06-13

    摘要: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.