COMPENSATION SUB-PIXEL UNIT, METHODS OF FABRICATING AND DRIVING THE SAME, AND PIXEL STRUCTURE AND DISPLAY PANEL USING THE SAME

    公开(公告)号:US20200135111A1

    公开(公告)日:2020-04-30

    申请号:US16506433

    申请日:2019-07-09

    Inventor: Jinqian Wang

    Abstract: The present disclosure relates to display technology field, particularly to a compensation sub-pixel unit, a method of fabricating the compensation sub-pixel unit, a method of driving the compensation sub-pixel unit, a pixel structure and a display panel. The compensation sub-pixel unit includes a piezoelectric film. The compensation sub-pixel unit includes a switching transistor that has a control end connected to the piezoelectric film layer, and a first end connected to a data voltage signal end. The compensation sub-pixel unit includes a driving transistor that has a control end connected to a gate voltage signal end, a first end connected to a second end of the switching transistor, and a second end connected to a power signal end.

    DEVICE FOR FILM THICKNESS MEASUREMENT AND METHOD FOR FILM THICKNESS MEASUREMENT
    3.
    发明申请
    DEVICE FOR FILM THICKNESS MEASUREMENT AND METHOD FOR FILM THICKNESS MEASUREMENT 有权
    薄膜厚度测量装置和薄膜厚度测量方法

    公开(公告)号:US20170074633A1

    公开(公告)日:2017-03-16

    申请号:US15122731

    申请日:2015-09-15

    CPC classification number: G01B7/06 G01B5/066 G01B7/085 G01B7/16

    Abstract: The embodiments of the invention disclose a device for film thickness measurement and a method for film thickness measurement. The device comprises a planar indenter, a collecting unit and a processing unit. The planar indenter comprises a base plate and a piezoelectric film layer. The collecting unit comprises a plurality of collecting circuits evenly distributed above the piezoelectric film layer and spaced from each other. The collecting circuits are used for collecting current signals generated when the piezoelectric film layer deforms at positions corresponding to the collecting circuits. The processing unit is used for calculating a film thickness of the film sample to be measured based on the current signals collected by each of the collecting circuits.

    Abstract translation: 本发明的实施例公开了一种用于膜厚度测量的装置和用于膜厚测量的方法。 该装置包括平面压头,收集单元和处理单元。 平面压头包括基板和压电膜层。 收集单元包括均匀地分布在压电膜层上方并彼此间隔开的多个收集电路。 集电电路用于收集当压电薄膜层在与集电电路相对应的位置变形时产生的电流信号。 处理单元用于基于由每个集电电路收集的电流信号计算要测量的膜样品的膜厚度。

    Display panel and deformation sensing method thereof, and display device

    公开(公告)号:US11016625B2

    公开(公告)日:2021-05-25

    申请号:US16761976

    申请日:2019-10-16

    Abstract: A display panel and deformation sensing method thereof, and a display device are provided. The display panel includes a substrate, and a deformation sensing unit on the substrate; the deformation sensing unit includes a first electrode, a second electrode, and a third electrode, the second electrode and the third electrode being configured to form a first capacitor, the first electrode and the second electrode being configured to form a second capacitor, the first electrode and the third electrode being configured to form a third capacitor, and the first capacitor, the second capacitor, and the third capacitor being configured to determine a shape-state of the display panel.

    Compensation sub-pixel unit, methods of fabricating and driving the same, and pixel structure and display panel using the same

    公开(公告)号:US10706783B2

    公开(公告)日:2020-07-07

    申请号:US16506433

    申请日:2019-07-09

    Inventor: Jinqian Wang

    Abstract: The present disclosure relates to display technology field, particularly to a compensation sub-pixel unit, a method of fabricating the compensation sub-pixel unit, a method of driving the compensation sub-pixel unit, a pixel structure and a display panel. The compensation sub-pixel unit includes a piezoelectric film. The compensation sub-pixel unit includes a switching transistor that has a control end connected to the piezoelectric film layer, and a first end connected to a data voltage signal end. The compensation sub-pixel unit includes a driving transistor that has a control end connected to a gate voltage signal end, a first end connected to a second end of the switching transistor, and a second end connected to a power signal end.

    Device for film thickness measurement and method for film thickness measurement

    公开(公告)号:US09879971B2

    公开(公告)日:2018-01-30

    申请号:US15122731

    申请日:2015-09-15

    CPC classification number: G01B7/06 G01B5/066 G01B7/085 G01B7/16

    Abstract: A device for film thickness measurement and a method for film thickness measurement are disclosed. The device includes a planar indenter, a collecting unit and a processing unit. The planar indenter includes a base plate and a piezoelectric film layer. The collecting unit includes a plurality of collecting circuits evenly distributed above the piezoelectric film layer and spaced from each other. The collecting circuits are used for collecting current signals generated when the piezoelectric film layer deforms at positions corresponding to the collecting circuits. The processing unit is used for calculating a film thickness of the film sample to be measured based on the current signals collected by each of the collecting circuits.

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