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公开(公告)号：US20210005632A1
公开(公告)日：2021-01-07
申请号：US16913435
申请日：2020-06-26
Applicant: BOE Technology Group Co., Ltd.
Inventor： Hsuanwei MAI , Hua HUANG , Shulei LI , Song FANG
Abstract: The present disclosure provides a display substrate and a method of manufacturing the same, and a display device. The display substrate includes a base substrate; a driving circuit layer disposed on the base substrate; and a planarization layer disposed on a side of the driving circuit layer away from the base substrate and having a plurality of conductive pads therein, the plurality of conductive pads are respectively electrically coupled to electrodes in the driving circuit layer, and a surface of each of the plurality of conductive pads away from the base substrate is flush with a surface of the planarization layer away from the base substrate.
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公开(公告)号：US20220091460A1
公开(公告)日：2022-03-24
申请号：US17225077
申请日：2021-04-07
Applicant: BOE Technology Group Co., Ltd.
Inventor： Shulei LI , Menghua ZHAO , Changhan HSIEH , Zhao KANG
IPC: G02F1/1335 , G02F1/1343 , G02F1/1339
Abstract: Provided are a display panel, a preparation method thereof, and a display apparatus. The display panel includes an array substrate and a color filter substrate aligned and combined into a cell. The color filter substrate includes a first base substrate and a plurality of color resist blocks arranged at intervals on the first base substrate. The array substrate includes a second base substrate and a plurality of pixel electrodes arranged at intervals on the second base substrate. The pixel electrodes are in one-to-one correspondence with the color resist blocks. The display panel includes a bending area and a non-bending area located at least on one side of the bending area. A density of the pixel electrodes in the bending area is less than that in the non-bending area, and a density of the color resist blocks in the bending area is less than that in the non-bending area.
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公开(公告)号：US20240257772A1
公开(公告)日：2024-08-01
申请号：US18290924
申请日：2022-09-05
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yuzhen GUO , Haoliang ZHENG , Minghua XUAN , Hebin ZHAO , Meirong LU , Chenyang ZHANG , Li XIAO , Xiaorong CUI , Jiao ZHAO , Shulei LI , Weixing LIU , Jintao PENG , Chunfang ZHANG , Xinxing WANG , Zhiqiang XU , Wanpeng TENG , Kai GUO
IPC: G09G3/34 , G02F1/167 , G02F1/16756 , G02F1/16766 , G02F1/1677
CPC classification number: G09G3/344 , G02F1/167 , G02F1/16756 , G02F1/16766 , G02F1/1677
Abstract: A display panel, a method for driving a display panel, and a display apparatus are provided. The display panel includes a first base substrate and a plurality of pixels on one side of the first base substrate. Each pixel includes: a plurality of pixel sub-electrodes independent from each other and configured to form an electric field with an included angle greater than 0 with respect to a direction perpendicular to the first base substrate under control of incompletely same driving signals; a common electrode on a side of the pixel electrode away from the first base substrate; and an electrophoretic liquid layer between the pixel electrode and the common electrode, including a plurality of charged particles therein.
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Patent Agency Ranking
公开(公告)号：US20220352000A1
公开(公告)日：2022-11-03
申请号：US17427628
申请日：2020-10-30
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Haixu LI , Xiao ZHANG , Fei WANG , Mingxing WANG , Shulei LI , Xue DONG , Guangcai YUAN , Zhanfeng CAO , Xin GU , Ke WANG , Feng QU , Xuan LIANG , Junwei YAN
IPC: H01L21/683 , H01L25/075 , H01L33/62
Abstract: A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.
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公开(公告)号：US20210159303A1
公开(公告)日：2021-05-27
申请号：US17042625
申请日：2020-04-09
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shulei LI , Hua HUANG , Changhan HSIEH
Abstract: Disclosed are a display panel, a manufacturing method of the display panel, and a display device including the display panel. The display panel includes an insulating substrate; a first circuit at a first side of the insulating substrate; and a second circuit at a second side of the insulating substrate. The first side and the second side of the insulating substrate are opposite to each other in a first direction perpendicular to a display surface, and the first circuit and the second circuit are electrically connected via a conductor penetrating the insulating substrate in the first direction.
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公开(公告)号：US20240411196A1
公开(公告)日：2024-12-12
申请号：US18700726
申请日：2023-05-05
Applicant: BOE Technology Group Co., Ltd.
Inventor： Shulei LI , Xue DONG , Xin GU , Hua HUANG , Yichi ZHANG
IPC: G02F1/167 , G02F1/16756 , G02F1/16761 , G02F1/16766 , G02F1/1677 , G02F1/1685
Abstract: A display panel, a preparation method therefor, and an electronic device. The display panel comprises: a first substrate and a second substrate arranged oppositely; a reflection layer on one side of the first substrate; a color resist layer on the side of the reflection layer away from the first substrate; a pixel electrode layer on the side of the color resist layer away from the first substrate and comprising multiple sub-pixel electrodes arranged at intervals; a common electrode layer on one side of the second substrate; and pixel isolation columns between first and second substrates and defining multiple sub-pixel regions therebetween, are black and white charged microspheres in the sub-pixel regions, there are at least two sub-pixel electrodes in one sub-pixel region, and the area of orthographic projections of the sub-pixel electrodes in one sub-pixel region is less than that of the color resist layer, on the first substrate.
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公开(公告)号：US20240019726A1
公开(公告)日：2024-01-18
申请号：US18032789
申请日：2020-10-30
Applicant: BOE Technology Group Co., Ltd.
IPC: G02F1/1333
CPC classification number: G02F1/133354 , G02F1/133377
Abstract: A mass transfer method for micro light-emitting diodes (W) includes: picking up micro light-emitting diodes (W) on an element substrate (200) by using a transfer substrate (300), and transferring the micro light-emitting diodes (W) after pickup to an intermediate carrying substrate (400); and transferring micro light-emitting diodes (W), which are on the intermediate carrying substrate (400) and correspond to all sub-pixels (SPX) on a target substrate (100), into the sub-pixels (SPX) of the target substrate (100) at one time, such that all the sub-pixels (SPX) on the target substrate (100) receives the micro light-emitting diodes (W) at one time.
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公开(公告)号：US20220382097A1
公开(公告)日：2022-12-01
申请号：US16977300
申请日：2019-11-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
IPC: G02F1/1333 , G02F1/1335
Abstract: A display panel motherboard, a cutting method and a manufacturing method thereof, a display panel, and a display device are provided. The display panel motherboard includes at least three mother substrates, at least one display panel unit, and a cutting region. The at least three mother substrates are stacked with each other, at least a portion of the at least one display panel unit is surrounded by the cutting region, and an organic film layer is not disposed in at least two of the at least three mother substrates in the cutting region.
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