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公开(公告)号：US09963297B2
公开(公告)日：2018-05-08
申请号：US15107581
申请日：2016-01-21
CPC分类号： B65G21/10 , B65G13/12 , B65G47/82 , B65G49/064 , C03B2225/02 , H01L21/67259 , H01L21/67712 , H01L21/68 , H01L21/68707 , Y02P40/57
摘要： The present disclosure provides a positioning foot, a positioning device and a method for correcting position of a glass substrate, and belongs to the technical field of automatic positioning. The positioning foot of the present disclosure comprises: a contact member for contacting a side of the glass substrate; an elastic member, a first end of which is connected with the contact member and receives a counterforce from the glass substrate delivered by the contact member so as to compress the elastic member, and a second end of which is fixed; and a sensor fixed on the second end of the elastic member. Wherein, the contact member is arranged to be displaced with a compression action of the elastic member, and after the contact member is displaced to a predetermined position, the sensor is triggered to be in an “ON” state such that the elastic member stops the compression action.
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公开(公告)号：US10221086B2
公开(公告)日：2019-03-05
申请号：US14437027
申请日：2014-09-30
发明人： Dai Dong , Weigang Gong , Yang Huang , Sheng Tao
IPC分类号： C03B33/09 , C03B33/02 , B23K26/03 , B23K26/142 , B23K26/388 , B23K26/70 , C03B33/04 , B23K26/382 , B23K26/40 , B23K26/402 , B23K26/0622 , B23K103/00
摘要： The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO2 laser beam, aligning the CO2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.
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公开(公告)号：US20210162554A1
公开(公告)日：2021-06-03
申请号：US15780480
申请日：2017-10-17
发明人： Sheng Tao , Wenlong Zhu , Qingyang Xu , Yunze Li , Zuliang Wang
摘要： A stage for cutting process and cutting method thereof, processing apparatus are disclosed. The stage includes a support substrate and a driving unit disposed on the support substrate. The driving unit is configured to drive the support substrate to rotate around a first direction in a board surface of the support substrate so as to remove foreign matters on the support substrate. The driving unit disposed in the stage can drive the rotation of the stage to allow foreign matters on the stage to automatically slide down.
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公开(公告)号：US09963376B2
公开(公告)日：2018-05-08
申请号：US14770581
申请日：2015-05-19
发明人： Dai Dong , Yang Huang , Sheng Tao , Bingbing Chu
IPC分类号： C03B33/08 , B23K26/364 , B23K26/402 , C03B33/02 , C03B33/037 , C03B33/04 , B23K103/00
CPC分类号： C03B33/082 , B23K26/0006 , B23K26/359 , B23K26/364 , B23K26/402 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/037 , C03B33/04
摘要： A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.
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公开(公告)号：US20170210568A1
公开(公告)日：2017-07-27
申请号：US15107581
申请日：2016-01-21
CPC分类号： B65G21/10 , B65G13/12 , B65G47/82 , B65G49/064 , C03B2225/02 , H01L21/67259 , H01L21/67712 , H01L21/68 , H01L21/68707 , Y02P40/57
摘要： The present disclosure provides a positioning foot, a positioning device and a method for correcting position of a glass substrate, and belongs to the technical field of automatic positioning. The positioning foot of the present disclosure comprises: a contact member for contacting a side of the glass substrate; an elastic member, a first end of which is connected with the contact member and receives a counterforce from the glass substrate delivered by the contact member so as to compress the elastic member, and a second end of which is fixed; and a sensor fixed on the second end of the elastic member. Wherein, the contact member is arranged to be displaced with a compression action of the elastic member, and after the contact member is displaced to a predetermined position, the sensor is triggered to be in an “ON” state such that the elastic member stops the compression action.
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